Multiple barrier layer encapsulation stack

ABSTRACT

A process for encapsulating an apparatus to restrict environmental element permeation between the apparatus and an external environment includes applying multiple barrier layers to the apparatus and preceding each layer application with a separate cleaning of the presently-exposed apparatus surface, resulting in an apparatus which includes an encapsulation stack, where the encapsulation stack includes a multi-layer stack of barrier layers. Each separate cleaning removes particles from the presently-exposed apparatus surface, exposing gaps in the barrier layer formed by the particles, and the subsequently-applied barrier layer at least partially fills the gaps, so that a permeation pathway through the encapsulation stack via gap spaces is restricted. The quantity of barrier layers applied to form the stack can be based on a determined probability that a stack of the particular quantity of barrier layers is independent of at least a certain quantity of continuous permeation pathways through the stack.

PRIORITY INFORMATION

This application is a divisional of U.S. patent application Ser. No.14/944,072, filed Nov. 17, 2015, now U.S. Pat. No. 10,096,533, whichclaims benefit of priority to U.S. Provisional Patent Application No.62/080,796, filed Nov. 17, 2014 titled “MULTIPLE BARRIER LAYERENCAPSULATION STACK,” which are hereby incorporated by reference hereinin their entirety.

BACKGROUND

Various apparatuses can include a substrate, a device provided on one ormore substrates, etc. Such devices can include one or more ofelectrochromic (EC) devices, light emitting diodes (OLEDs),photovoltaics (PV), thin film devices, thin film battery devices, somecombination thereof, etc. In some cases, an apparatus can be located inan environment which includes environmental elements which can damage ordegrade the device, substrate, etc. For example, an EC device may beexposed to an ambient environment in which the ambient environment is amixture of ambient air and water vapor. Environmental elements, whichcan include one or more various instances of particulate matter,precipitation, gases, liquids, solids, etc., from the ambientenvironment can permeate through various layers of various apparatuses,including EC devices. For example, environmental elements can includeone or more of water, oxygen, some combination thereof, etc., and wherean apparatus includes a EC device is sensitive to water (also referredto herein as sensitivity to “moisture”), permeation of water to the ECdevice can cause degradation of one or more elements of the EC device,which can result in degraded functionality of the EC device. Degradedfunctionality of an EC device can include a degraded structural abilityof the EC device to change coloration based at least in part uponapplied electric potential. Various other apparatuses, including organiclight emitting diodes (OLEDs), photovoltaics (PV), thin film devices,some combination thereof, etc. can be sensitive to one or more variousenvironmental elements.

In some cases, an apparatus is structured to include a barrier layerwhich provides at least some protection against environmental elementpermeation from the ambient environment. In some cases, an appliedbarrier layer is referred to as an “encapsulation layer”, “encapsulationstack,” or the like. Such structuring of an apparatus may be referred toas “passivating” the apparatus, and an apparatus structured to restrictenvironmental element permeation between environmental element-sensitiveportions of the apparatus and the external environment via one or morebarriers may be referred to as a “passivated” apparatus.

A barrier layer applied to an apparatus can, in some cases, includeimperfections, defects, etc. which can result in permeation “pathways”through the barrier layer via which environmental elements can pass,thereby leading to environmental element permeation through the barrierlayer. Such defects can result from the presence of particles on anexposed apparatus surface to which an encapsulation stack is applied. Insome cases, a particle can be deposited on an exposed surface as aresult of one or more portions of a barrier layer-application process.

In some cases, the presence of particles on an exposed surface canresult in the formation of gaps, also referred to interchangeably hereinas “gap spaces” in an applied barrier layer. Such gap space formationcan result from the presence, on an exposed surface, of a particle whichis substantially larger in diameter than the applied barrier layerthickness, such that the stress on portions of the barrier layersurrounding the particle result in localized weakening in adhesion ofthe barrier layer, which can result in localized barrier layerdetachment, failure, etc. around the particle. For example, some barrierlayer application processes include Atomic Layer Deposition (ALD) whichprovides a conformal, thin layer of a permeation-resistant material onan exposed surface. In some cases, particles present on the exposedsurface prior to, or as a result of, the barrier layer applicationprocess can be substantially thicker (i.e., wider in diameter) than thethickness of the barrier layer applied via ALD, resulting in formationof a gap space in the barrier layer, where the gap space provides apermeation pathway for environmental elements to pass from an externalenvironment to the apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a perspective view of an apparatus which comprises asubstrate, a device provided on the substrate, and an encapsulationlayer, applied to a substrate-distal side of the device, whichpassivates the apparatus against at least some environmental elements,according to some embodiments.

FIG. 2 illustrates a partial cross-sectional view of an apparatus withan applied barrier layer which includes a gap space defect formed as aresult of a particle, according to some embodiments.

FIG. 3 illustrates multiple views of progressive degradation of anapparatus over time, as a result of gap spaces in a barrier layerapplied to the apparatus, according to some embodiments.

FIG. 4A illustrates a partial cross-sectional view of an apparatus whichincludes an multi-layer encapsulation stack which is structured toinclude alternating conformal and permeation-resistant layers, accordingto some embodiments.

FIG. 4B illustrates a partial cross-sectional view of an apparatus whichincludes a multi-layer encapsulation stack which is structured toinclude multiple consecutive permeation-resistant layers, according tosome embodiments.

FIG. 5A-H illustrate a process of applying a multi-layer encapsulationstack on an apparatus which includes implementing a cleaning of apresently-exposed apparatus surface prior to applying each of themultiple barrier layers, according to some embodiments.

FIG. 6 illustrates a partial cross-sectional view of an apparatus whichincludes a multi-layer encapsulation stack which is structured toinclude multiple consecutively-applied permeation-resistant layers withcleaning of the presently-exposed apparatus surface prior to each layerapplication, according to some embodiments.

FIG. 7A-D illustrate various cleaning processes which can be implementedon a presently-exposed apparatus surface, according to some embodiments.

FIG. 8 illustrates a partial cross-sectional view of an apparatus whichincludes a substrate and an encapsulation stack applied to a surface ofthe substrate, according to some embodiments.

FIG. 9 illustrates a perspective view of an apparatus which isstructured to be at least partially flexible and includes anencapsulation stack, according to some embodiments.

FIG. 10 illustrates a partial cross-sectional view of an apparatus whichincludes a substrate, a device provided on a portion of the substrateand an encapsulation stack applied to a surface of the apparatus, suchthat the encapsulation stack covers both at least some portions of thedevice and at least some exposed portions of the substrate, according tosome embodiments.

FIG. 11 illustrates a perspective view of an ovoid-shaped device whichcan be included in an apparatus, according to some embodiments.

FIG. 12A-B illustrate an apparatus which includes a ovoid EC devicesubsequent to applying an encapsulation layer on the apparatus andcoupling one or more sets of bus bars to the EC device, according tosome embodiments.

FIG. 13 illustrates an apparatus fabrication system which includes anencapsulation stack application system, according to some embodiments.

FIG. 14 illustrates an encapsulation stack application system whichapplies multiple barrier layers on the apparatus with preceding cleaningof the presently-exposed surface, according to some embodiments.

FIG. 15 illustrates a control system which is structured to controlencapsulation stack application to an apparatus, according to someembodiments.

FIG. 16A illustrates applying a multi-layer encapsulation stack,according to some embodiments.

FIG. 16B illustrates determining a particular number of barrier layersto apply to establish a multi-layer encapsulation stack, according tosome embodiments.

FIG. 17 is a block diagram illustrating an example computer system thatmay be used in some embodiments.

The various embodiments described herein are susceptible to variousmodifications and alternative forms. Specific embodiments are shown byway of example in the drawings and will herein be described in detail.It should be understood, however, that the drawings and detaileddescription thereto are not intended to limit the disclosure to theparticular form disclosed, but on the contrary, the intention is tocover all modifications, equivalents and alternatives falling within thespirit and scope of the appended claims. The headings used herein arefor organizational purposes only and are not meant to be used to limitthe scope of the description or the claims. As used throughout thisapplication, the word “may” is used in a permissive sense (i.e., meaninghaving the potential to), rather than the mandatory sense (i.e., meaningmust). Similarly, the words “include,” “including,” and “includes” meanincluding, but not limited to.

DETAILED DESCRIPTION OF EMBODIMENTS

Various embodiments of an apparatus which includes a multi-layerencapsulation stack and methods for applying the multi-layerencapsulation stack to the apparatus are disclosed. An apparatus caninclude one or more of a substrate, a device provided on the substrate,etc. The multi-layer encapsulation stack can include multipleconsecutively-applied barrier layers, where each individual barrierlayer is structured to resist environmental element permeation throughthe respective barrier layer. An encapsulation stack can include one ormore various types of barrier layers including, without limitation, oneor more of a thin film barrier layer, a barrier layer applied via atomiclayer deposition (ALD), a laminate barrier layer, a conformal barrierlayer, an inorganic barrier layer, some combination thereof, etc. Abarrier layer which is structured to resist environmental elementpermeation can include a barrier layer which is structured to resistpermeation of one or more various environmental elements through therespective barrier layer. Environmental elements can include one or moreof specific elements, molecules, substances, etc. which can be presentin an external environment, relative to an apparatus to which anencapsulation stack is applied. In some embodiments, environmentalelements include one or more of any substances, molecules, atomicelements, etc. which can be present in an ambient environment, includingany particulate matter, gases, liquids, atmospheric precipitation,substances included as vapor in an environment, some combinationthereof, etc. For example, an environmental element, as referred toherein, can include one or more various substances including, withoutlimitation, oxygen, water, water included as vapor in ambient air (alsoreferred to as “humidity”, “moisture”, etc.), some combination thereof,etc.

In some embodiments, the encapsulation stack is applied via a processwhich includes applying each of the separate barrier layers of themulti-layer encapsulation stack consecutively, where each separatebarrier layer application of a separate barrier layer is preceded by acleaning of the presently-exposed apparatus surface to which the barrierlayer is to be applied. A presently-exposed apparatus surface caninclude a particular surface of one or more portions of the apparatus,including an exposed surface of one or more of a substrate, exposedsurface of a device provided on the substrate, some combination thereof,etc. An exposed surface of a device provided on the substrate caninclude an exposed substrate-distal surface of the device.

In some embodiments, the presently-exposed apparatus surface to which abarrier layer is to be applied, and which is cleaned prior to saidapplication, can include an exposed surface of one or more barrierlayers which were previously applied to the apparatus. For example,where an encapsulation stack includes two consecutively-applied barrierlayers, a process via which the encapsulation stack is applied caninclude cleaning an exposed apparatus surface prior to applying thefirst barrier layer to the exposed apparatus surface and subsequentlyapplying the first barrier layer, such that the apparatus comprises apresently-exposed apparatus surface which includes an exposed surface ofthe first barrier layer. The presently-exposed apparatus surface whichincludes the exposed surface of the first barrier layer can be cleanedprior to application of the second barrier layer, and the second barrierlayer can be subsequently be applied to the presently-exposed apparatussurface. Cleaning a presently-exposed apparatus surface, as describedherein, can include implementing one or more particular cleaningprocesses on at least a portion of a presently-exposed apparatussurface.

In some embodiments, cleaning the presently-exposed apparatus surfaceprior to application of a particular barrier layer to thepresently-exposed apparatus surface, where another barrier layer waspreviously applied to the apparatus and the presently-exposed apparatussurface includes an exposed surface of the previously-applied “other”barrier layer, can be referred to as interposing consecutive barrierlayer applications with a cleaning of the presently-exposed apparatussurface, cleaning a presently-exposed apparatus surface betweenconsecutive barrier layer applications, some combination thereof, etc.

In some embodiments, cleaning the presently-exposed apparatus surfaceprior to each of the barrier layer applications, between consecutivebarrier layer applications, etc. results in an encapsulation stack whichcomprises multiple consecutively-applied barrier layers where theencapsulation stack is at least partially free from continuouspermeation pathways via which environmental elements can permeate froman external environment to the apparatus through the encapsulationstack. The cleaning of the presently-exposed apparatus surface prior to,between, etc. consecutive barrier layer applications can result in eachapplied barrier layer filling in at least some of any gap spaces presentin a previously-applied barrier layer, thereby sealing off potentialpermeation pathways through the stack, formed from gap spaces in theindividual barrier layers, through which environmental elements couldpermeate between an external environment and an apparatus to which thestack is applied.

Such a resulting encapsulation stack can protect environmentalelement-sensitive portions of the apparatus from environmental elements.Furthermore, the encapsulation stack can include a relatively lowthickness, relative to encapsulation stacks which include organic layerswhich restrict environmental element permeation through a stack bycoating particles, creating tortuous permeation pathways through thestack, etc. In addition, the process via which the encapsulation stackis applied can have relaxed cleanliness requirements, relative to aprocess which applies one layer, a process which applies multiple layerswithout cleaning prior to, between, etc. applying each of the multiplebarrier layers, as defects in a given applied barrier layer can bemitigated by a subsequently-applied barrier layer.

For example, in some embodiments, an encapsulation stack includesmultiple barrier layers which each comprise an inorganic barrier layer,where the barrier layer comprises an inorganic material structured toresist environmental element permeation through the material. In someembodiments, the multi-layer structure of the encapsulation stackincludes consecutive barrier layers comprising alternating high/lowrefractive index materials, e.g. Si₃N₄/SiO₂, can be applied by e.g., ameta mode process (sputtering). This process can require very cleansurfaces with minimal particles that could contribute to pathways forenvironmental element permeation through the film.

In some embodiments, adhesion of the stack to apparatus surfaces, andminimized compressive stress in the stack (e.g., <600 MPa) can result inadded durability of the stack in restricting environmental elementpermeation over time. Dense amorphous alternating organic and inorganiclayered stacks can be applied by PECVD methods. These films can behighly adherent with reduced defects due to the amorphous, conformingfilm properties. Dense reduced defect multilayer coatings can also beapplied by Atomic Layer Deposition (ALD) techniques.

In some embodiments, an encapsulation stack includes a particular numberof barrier layers, where the number of layers is predetermined based onvarious factors, including one or more of the materials included in eachof the layers, the surface area of the apparatus covered by theencapsulation stack, the estimated distribution and size of particlespresent on an exposed surface preceding and following each barrier layerapplication, an estimated number, distribution, and size of gap spacespresent in each individual barrier layer upon application of the givenbarrier layer, some combination thereof, etc. Based on one or more ofthe factors, a probability can be determined, at one or more particularconfidence levels, that an encapsulation stack comprising a given numberof barrier layers will not include any more than a certain number ofcontinuous permeation pathways through the stack, via aligned gap spacesin the various individual barrier layers. The particular number oflayers can be determined based on a minimum number of layers at whichthe determined probability, at a particular confidence level, that theresulting encapsulation stack includes at least a certain minimum numberof pathways through the stack is less than a threshold value. In anotherexample, the particular number of layers can be determined based on aminimum number of layers at which the determined probability, at aparticular confidence level, that the resulting encapsulation stackincludes no more than a certain minimum number of pathways through thestack is greater than a threshold value.

As used herein, “configuring” an apparatus, barrier layer, device,system, process, etc. can be referred to interchangeably as“structuring” same. An apparatus, barrier layer, device, system,process, etc. which is “configured to” do something can be referred tointerchangeably as an apparatus, barrier layer, device, system, process,etc. which is “structured” to do something, “structurally configured” todo something, etc.

I. Encapsulation Stack Protection of an Apparatus

FIG. 1 illustrates a perspective view of an apparatus which comprises asubstrate, a device provided on the substrate, and an encapsulationlayer, applied to a substrate-distal side of the device, whichpassivates the apparatus against at least some environmental elements,according to some embodiments. Apparatus 100 includes a substrate 110, adevice 120 provided on a surface of the substrate, and an encapsulationstack 130 applied to a substrate-distal surface of the device 120.

In some embodiments, the device 120 includes an electrochromic (EC)device. The EC device can include an EC film stack and conductive layerson opposite sides of the EC film stack. An EC film stack, as referred toherein, can include a counter-electrode (CE) layer, an electrochromic(EC) layer, and an ion conducting (IC) layer between the two. In someembodiments, one of the CE layer or the EC layer is structured toreversibly insert ions such as cations, including one or more of H+,Li+, D+, Na+, K+ or anions, including one or more of OH—, especiallymade of an anodic (or respectively cathodic) electrochromic material;and the other of the CE layer or the EC layer is structure to reversiblyinserting said ions, especially made of a cathodic (or respectivelyanodic) electrochromic material. The IC layer, in some embodiments, isstructured to include an electrolyte layer. The EC film stack may becharacterized in that at least one of the CE layer or the EC layer maybe structure to reversibly insert said ions, including layer made of ananodic or cathodic electrochromic material, has a sufficient thicknessto allow all the ions to be inserted without electrochemicallydisfunctioning said active layers, in that the IC layer having anelectrolyte function comprises at least one layer based on a materialchosen from tantalum oxide, tungsten oxide, molybdenum oxide, antimonyoxide, niobium oxide, chromium oxide, cobalt oxide, titanium oxide, tinoxide, nickel oxide, zinc oxide optionally alloyed with aluminum,zirconium oxide, aluminum oxide, silicon oxide optionally alloyed withaluminum, silicon nitride optionally alloyed with aluminum or withboron, boron nitride, aluminum nitride, vanadium oxide optionallyalloyed with aluminum, and tin zinc oxide, at least one of these oxidesbeing optionally hydrogenated, or nitrided, in that one or more of theCE layer or the EC layer comprises at least one of the followingcompounds: oxides of tungsten W, niobium Nb, tin Sn, bismuth Bi,vanadium V, nickel Ni, iridium Ir, antimony Sb and tantalum Ta, alone oras a mixture, and optionally including an additional metal such astitanium, rhenium or cobalt, and in that the thickness of one or more ofthe EC layer or the CE layer is between 70 and 250 urn, between 150 and220 um, etc.

The EC film stack can include various materials, including tungstenoxides. The CE layer can include various materials, including one ormore tungsten-nickel oxides. The IC layer can include various materialsincluding one or more silicon oxides. The charge can include variouscharged electrolyte species, including lithium ions. An IC layer caninclude a layer region, a multilayer region, an interfacial region, somecombination thereof, or the like. An IC layer which includes aninterfacial region can include one or more component materials of one ormore of the EC or CE layer.

In some embodiments, each of the EC regions, conductive layer regions,etc. of the EC device may have the same or different sizes, volume,and/or surface areas. In other embodiments, each of the EC regions,conductive layer regions, etc. may have the same or different shapes(including curved or arcuate shapes).

In some embodiments, the device 120 can include one or more varioustypes of devices, including one or more thin film devices, photovoltaicdevices, organic light-emitting diode (OLED) devices, etc. It will beunderstood that the thin film devices which can be included in thedevice 120 can encompass any known thin film devices.

As shown, encapsulation stack 130 is located between the collectivedevice 120 and substrate 110 and an external environment 140. Anexternal environment, as referred to herein, can include an ambientenvironment, an interior environment included within the housing of adevice, some combination thereof, etc. In some embodiments, one or moreof device 120 and substrate 110 includes one or more environmentalelement-sensitive portions, also referred to herein an environmentalelement sensitive portions of an apparatus, and encapsulation stack 130restricts permeation of said environmental elements between the externalenvironment 140 and such portions, thereby protecting the apparatus 100from damage and degradation due to environmental elements.

FIG. 2 illustrates a partial cross-sectional view of an apparatus withan applied barrier layer which includes a gap space defect formed as aresult of a particle, according to some embodiments. Apparatus 200 canbe included in any of the above embodiments. Apparatus 200 includes anapparatus surface 210 of an apparatus portion 205 and a barrier layer220 applied to the surface 210. The barrier layer 220 can be structuredto restrict environmental element permeation between the surface 210 andan external environment 250 via the layer 220.

In some embodiments, a barrier layer can be compromised, and suchcompromising can be referred to as an at least partial “failure” of thebarrier layer, where such a comprising of the barrier layer results in agap, gap space, etc. in the barrier layer through which environmentalelements can permeate. Such a compromising of the barrier layer can beat least partially based on the presence of a particle on the apparatussurface 210 prior to application of the barrier layer 220. In someembodiments, a particle can have a diameter which is a significantproportion, a multiple, etc. of the thickness of the applied barrierlayer, which can result in localized failure of the barrier layer aroundthe particle which results in the formation of a gap space in thebarrier layer.

For example, in the illustrated embodiment shown in FIG. 2, a barrierlayer 220 applied to surface 210 of apparatus portion 205 has aparticular thickness 270 which can be significantly less than athickness 275 of a particle 230 on the apparatus 200. The barrier layer220, in some embodiments, is a conformal layer which at least partiallyconforms to the contours of surface 210. As also shown, a particle 230is present upon the surface 210 and is several multiples larger than thethickness of the barrier layer 220. In one non-limiting example, thebarrier layer thickness 270 can be approximately 5 nanometers-100nanometers in thickness, and the particle 5230 thickness 275 can beapproximately 3000-5000 nanometers in thickness, such that theparticular has an approximate thickness which is at least several timesthat of the barrier layer 220. It will be understood that thethicknesses of the barrier layer 220 and the particle can encompassother thicknesses. In some embodiments, where particle 230 is present onsurface 210 at the time of application of layer 220 on surface 210, theapplication process fails to apply the layer 220 in a space around theparticle 230, resulting in the formation of a gap space 240 in the layer220. The particle may not be affixed to the surface 210 and maysubsequently move from its illustrated position, thereby exposing thegap space 240 to the external environment and enabling environmentalelement permeation between the environment 250 and the apparatus 200 viaa permeation pathway which comprises the gap space 240. In someembodiments, where the layer 220 is conformal, the layer 220 can beapplied around and over particle 230. However, based at least in partupon the substantial size of the particle 230 relative to the thicknessof the layer 220, the contours in the layer 220 over the particle 230can result in relatively high stresses on the layer 220 which can resultin eventual localized failure of the layer 220 around the particle 230,resulting in formation of the gap space 240.

In some embodiments, apparatus 200 includes one or more environmentalelement-sensitive portions which can be damaged, degraded, etc. byenvironmental elements permeating through gap spaces 240 in layer 220from the environment 250. For example, apparatus 200 can include adevice provided on a substrate, including an electrochromic device,OLED, etc., where the surface 210 comprises a surface of the device, andwhere at least portion of the device to which environmental elements canpermeate from environment 250 through gap space 240 can be sensitive tosaid environmental elements, the presence of the gap space 240 canresult in damage, degradation, failure, etc. of the device.

FIG. 3 illustrates multiple views of progressive degradation of anapparatus over time, as a result of gap spaces in a barrier layerapplied to the apparatus, according to some embodiments. Apparatus 310can be included in any of the above embodiments.

In some embodiments, an apparatus which includes portions that aresensitive to environmental elements can be degraded over time based onpermeation of the environmental elements through one or more gap spacesin one or more barrier layers applied to the apparatus. In someembodiments, such degradation can propagate throughout a substantialproportion of the apparatus from a relatively small number of gapspaces, which can result in partial or total failure of the apparatus.

In the illustrated embodiment, for example, several views of anapparatus 310 are presented at separate points along a timeline 301,where the apparatus 310 includes an environmental element-sensitivedevice 311. The illustrated embodiment illustrates progressivepropagation of degradation of the apparatus over time based at least inpart upon gap spaces in one or more barrier layers applied to theapparatus 310.

The illustrated timeline 301 illustrates the progression of time “t”from a point in time t=0, where t=0 at the point in time at which abarrier layer is applied to an exposed surface of apparatus 310 andwhere the barrier layer comprises four gap spaces.

As shown at the first timestamp “t₁” 302, the apparatus 310A, at t₁,includes a functional region 311 which is undamaged and structured toperform a function and four distinct degraded regions 312 which arenonfunctional relative to region 311. For example, where apparatus 310comprises an OLED device which is sensitive to one or more environmentalelements, region 311 can comprise a region of the OLED which can emitlight and regions 312 can be at least partially degraded relative toregion 312, such that the portions of the OLED within regions 312 can beat least partially unable to emit light, based at least in part upondegradation of the regions 312 due to environmental element permeation.The four regions 312 can each be associated with a separate gap space ina corresponding one or more barrier layers (not shown in FIG. 3) appliedto the apparatus 310, where environmental elements are able to permeatefrom an external environment to four separate points on apparatus 310via four separate pathways through the one or more barrier layers. Eachseparate region 312 can encompass an initial point at whichenvironmental elements reach the apparatus 310 via a separate pathwaythrough the one or more barrier layers.

As shown at the second timestamp “t₂” 304, the apparatus 310B, at t₂,includes degraded regions 314 which have expanded in size, relative tothe regions 312 at time t₁. Because environmental elements can permeatethrough the one or more barrier layers to the apparatus 310 at pointswithin regions 312, the environmental elements can subsequently permeatethrough the apparatus itself, such that the degraded regions 312 canexpand over time to encompass greater proportions of the apparatus 310.As a result, as shown at time 304, the apparatus 310B includes afunctional region 311 which is smaller relative to time 302, and thefour separate degraded regions 314 are expanded.

As shown at the third timestamp “t₃” 306, the apparatus 310C, at t₃,includes degraded regions which have further expanded in size, such thatthe four separate regions 314 have merged into a single degraded region316 which encompasses a majority of the apparatus 310C, relative to thefunctional region 311. Such expansion of the degraded regions, based atleast in part upon environmental element permeation through theapparatus 310, can result in substantial degradation of the overallapparatus 310, such that the apparatus can be considered to be at leastpartially non-functional. For example, where apparatus 310 includes anOLED, and where degraded regions 316 are unable to emit light, relativeto functional region 311, the degradation of the OLED as shown at time306 can constitute a substantial loss of functionality of the OLED, suchthat the OLED may be considered to have lost useful functionality.

In some embodiments, the progressive degradation of the apparatus 310shown in FIG. 3 can occur over a relatively short period of elapsedtime. For example, in some embodiments, where the apparatus 310 is atleast partially sensitive to oxygen, degradation regions resulting fromoxygen permeation through individual gap spaces in a barrier layerapplied to apparatus 310 can become noticeable to unaided human visualobservation within a period of days of exposure to oxygen.

In some embodiments, an encapsulation stack can include multiple layers,which can include one or more barrier layers, and is structured toprovide augmented protection from environmental elements to anapparatus, relative to a single barrier layer.

FIG. 4A-B illustrate partial cross-sectional views of apparatuses whicheach include a multi-layer encapsulation stack. FIG. 4A illustrates apartial cross-sectional view of an apparatus which includes anmulti-layer encapsulation stack which is structured to includealternating conformal and permeation-resistant layers, according to someembodiments. FIG. 4B illustrates a partial cross-sectional view of anapparatus which includes a multi-layer encapsulation stack which isstructured to include multiple consecutive permeation-resistant layers,according to some embodiments. Each of the apparatuses 400A, 400Billustrated in FIG. 4A-B can be included, separately or in combination,in any of the above embodiments.

In some embodiments, an encapsulation stack includes a multi-layer stackcomprising alternating organic/inorganic layers including an organiclayer, which can include a polymer, monomer including an acrylate, etc.and inorganic barrier layer structured to restrict environmental elementpermeation, such as a layer comprising SiO₂ or Al₂O₃. A barrier layercan include multiple subsequently deposited dyads to achieve lowmoisture penetration rates. Such a stack relaxes the particulatecontamination requirement and reduces the probability of pathwaysthrough the complete encapsulation stack. Application of the stack to anapparatus is performed in vacuum, and the organic layer can be appliedas a liquid and rapidly cured. The next deposition can include theinorganic barrier layer, etc. The organic layer can be conformal and can“coat” defects conformally and prevent defects, including gap spaces inone or more barrier layers, from propagating directly through the stack.The resulting pathway for environmental elements through the stack canbe very torturous, such that the permeation rate can be reduced.

In some embodiments, an encapsulation stack, including a VITEX™, isformed on a thin polymer substrate, which can include PET. This stackcan then be laminated to an apparatus using one or more variousadhesives, including silicone adhesives, other “dry” adhesives such asSENTRYGLAS™, etc.

FIG. 4A illustrates an apparatus 400A which includes an apparatusportion 410, having a surface 412, to which an encapsulation stack 440is applied, where the stack 440 includes alternating organic layers420A-C and inorganic barrier layers 430A-B. As shown, the organic layers420A-C is each conformal and can “coat” particles 444 present on asurface 412 upon which the given organic layer is applied. For example,where particles 444 are present on surface 410, layer 420A, when appliedto surface 410, coats the particles 444 such that the particles areembedded within the layer 420A. In addition, as shown, each layer 420A-Chas sufficient thickness that the individual layers have a smoothexposed surface when applied, so that a subsequently-applied inorganiclayer 430 is applied on a smooth surface. As further shown, where theapplication of an inorganic layer 430A results in a particle 444 beingpresent on an exposed surface of the layer 430A, a subsequently appliedorganic layer 420B conformally coats the particle and embeds it withinthe layer 420B.

As further shown, although the individual barrier layers 420A-B eachinclude respective gap spaces 446A-B in the respective layers 430A-B,the continuous permeation pathway 480 which environmental elements canfollow through the stack 440 to permeate from environment 490 toapparatus surface 412 is relatively tortuous, based at last in part uponthe presence of multiple barrier layers 430A-B and the thickness of theorganic layers 420 bounding the alternating barrier layers 430. Althoughthe organic layers 420A-C may be permeable by the environmentalelements, the relatively increased length and winding of the permeationpathway 480 at least partially restricts, or at least impedes, thepermeation of environmental elements along pathway 480. Furthermore, theorganic layers 420 can “fill in” defects in a given exposed surface,including gap spaces, particles, etc. so that such defects do not affecta subsequently-applied barrier layer.

In some embodiments, an encapsulation stack which includes alternatingbarrier and organic layers can be substantially thicker than anencapsulation stack which does not include organic layers. Suchthickness can be based in part upon the use of the organic layers tocoat and embed defects, including particles, within the given organiclayers. For example, as shown, where each individual barrier layer430A-B is approximately 20 nm thick, each organic layer is approximately1000 nm thick. As a result, organic layers 420A-B embed particles 444which are substantially larger than the thickness of barrier layers430A-B while still providing smooth exposed surfaces 412 upon whichsubsequent barrier layers can be applied. As a result, the encapsulationstack 440 has an overall thickness of 3040 nm. In some embodiments, anencapsulation stack 440 which includes the alternating organic andinorganic barrier layers can be at least partially susceptible tostresses from flexing of the apparatus 410, including one or more ofcompression stresses or tension stresses, based at last in part upon thethickness of the stack 440.

FIG. 4B illustrates an apparatus 400B which includes an encapsulationstack 460 applied to a surface 461 of an apparatus portion 450. Theencapsulation stack 460 includes four consecutive barrier layers 462A-Dwhich each have an approximate thickness of 20 nm, such that the overallencapsulation stack 460 has an approximate thickness of 80 nm.

As shown in FIG. 4B, each individual barrier layer 462 can includeindividual defects specific to the individual barrier, and the multiplebarrier layers in the stack can collectively restrict environmentalelement permeation through individual defects of the individual layers.Such collective restriction can be based on the stack 460 beingstructured such that individual defects of individual barrier layers areprecluded from collectively establishing a permeation pathway throughthe entire stack 460. For example, in the illustrated embodiment of FIG.4B, each layer 462A-D includes at least one gap space 440C, and whilegap spaces in each of layers 462B-D collectively establish a pathwaythrough a portion of the stack 460, extending from surface 461, the gapspaces 440C in layer 462A does not align with the gap spaces in layers462B-D, such that the pathway does not extend through layer 462A to theenvironment 490. As a result, the individual gap spaces 440C in layers462A-D do not establish a permeation pathway through stack 460. Inaddition, the thickness of the stack 460 in FIG. 4B is substantiallyless than that of the stack 440 in FIG. 4A, as organic layers 420 arenot applied in stack 460 to coat and embed particles.

In some embodiments, the individual barrier layers 462A-D of stack 460are applied consecutively to form stack 460. The presence of particleson a presently-exposed apparatus surface to which a barrier layer is tobe applied can result in the layer becoming compromised. As noted withregard to FIG. 2, a particle can be substantially larger than thethickness of an individual barrier layer. In the illustrated embodimentof FIG. 4B, even a single particle with a diameter, or “thickness”, ofapproximately 100 nm can have a diameter greater than the thickness ofthe entire stack 460.

In some embodiments, application of a stack 460 which restrictspermeation between environment 490 and apparatus portion 460 can includeremoval of particles from surface 461 via implementation of a cleaningprocess upon surface 461, where the cleaning process removes particlesfrom surface 461. In some embodiments, the process of applying a barrierlayer to a presently-exposed apparatus surface can result in one or moreparticles being present in the applied layer, where the one or moreparticles result in the formation of one or more gap spaces in theapplied layer, even though the barrier layer is applied upon a surface461 which has been previously cleaned of particles via a cleaningprocess. Subsequently-applied barrier layers can at least partially fillin gap spaces of a given exposed surface, and a cleaning processimplemented on the exposed surface, even an exposed surface of anapplied barrier layer, can result in an exposed surface upon which asubsequent barrier layer can be applied. In some embodiments, eachindividual barrier layer 462A-D of an encapsulation stack 460 caninclude one or more individual defects, but the stack 460 can include asufficient number of barrier layers 462A-D to preclude the existence ofat least a certain number of continuous permeation pathways, formed viaaligned gap spaces, through each and every barrier layer in the stack,thereby restricting environmental element permeation through the stack.In some embodiments, the certain number of continuous pathways is 1(one), such that the stack includes a sufficient number of barrierlayers to preclude the existence of any continuous permeation pathwaysthrough the stack.

FIG. 5A-H illustrate a process of applying a multi-layer encapsulationstack on an apparatus which includes implementing a cleaning of apresently-exposed apparatus surface prior to applying each of themultiple barrier layers, according to some embodiments. The process canbe applied with regard to any of the apparatuses included in any of theembodiments included herein.

In the illustrated embodiment of FIG. 5A-H, the apparatus initiallycomprises a substrate 510 and a device 520 provided on at least aportion of the substrate 510 and an encapsulation stack 590 is appliedto the apparatus in a sequence of consecutive steps. The illustratedportion of the apparatus in FIG. 5A-H includes the device 520 providedupon an entirety of the visible substrate 510. It will be understoodthat some portions of the apparatus include portions of the substrate510 not covered by the device 520.

FIG. 5A illustrates the apparatus prior to application of the stack 590.Device 520 is provided on substrate 510. As shown, several particles 512are present on an exposed surface 511 of the device 520, where theexposed surface 511 is comprised in the exposed apparatus surface. InFIG. 5A, surface 511 is a presently-exposed apparatus surface.

FIG. 5B illustrates cleaning the presently-exposed apparatus surface 511via implementation of a cleaning process on the presently-exposedapparatus surface 511. The cleaning process, when implemented on surface511, removes 524 at least a portion of the particles 512, such thatsurface 511 is at least partially cleaned of particles. In theillustrated embodiment of FIG. 5B, the cleaning process which isimplemented comprises a jet of fluid 522, directed by a fluid sourcedevice 520 to impinge on the surface 511, where the fluid 522 carriesthe particles 512 away from surface 511. The fluid 522 can include anyknown cleaning fluid, including one or more solvents, and can includefluid in one or more states, including gaseous, liquid, some combinationthereof, etc.

It will be understood that, while the cleaning processes illustrated inFIG. 5A-H are shown to include fluid jet cleaning processes, each of thecleaning processes implemented in FIG. 5A-H can encompass any knowncleaning process and is not limited to fluid jet cleaning processes.

FIG. 5C illustrates application of a barrier layer 534 on surface 511. Abarrier layer 534 can be applied via any known barrier layer applicationprocess. The illustrated process shows an applicator 530 providing thematerial 532 of the barrier layer 534 to coat the presently-exposedsurface 511 to form the layer 534. In some embodiments, the barrierlayer includes a thin film barrier applied via a “sputtering” process.In some embodiments, the barrier layer includes a thin film barrierapplied via an atomic layer deposition process. Other barrier layerapplication processes will be understood to be encompassed.

As shown in FIG. 5C, although surface 511 was cleaned of particles 512via implementation of a cleaning process in FIG. 5B, the application ofbarrier layer 564 at FIG. 5C results in a barrier layer 534 whichincludes particles 536, where the particles 536 result in defects in thebarrier layer 534; including gap spaces 535A-B. Such particles 536 canbe deposited on the apparatus as a side effect of the application of thebarrier layer 534. For example, the cleanliness restrictions of theapplication at FIG. 5C can be sufficiently lax that particles 536 can bedeposited on the apparatus via the stream 532 of material provided fromthe applicator 530 onto surface 511. As shown in FIG. 5C, the particles536 can be sufficiently large in diameter to result in gap spaces 535A-Bwhich extend through the entirety of applied barrier layer 534.

As shown in FIG. 5C, application of the barrier layer 534 results in anew presently-exposed surface 531 of the apparatus, where the surface531 includes an exposed surface of the applied barrier layer 534.

FIG. 5D illustrates cleaning the presently-exposed apparatus surface 531via implementation of a cleaning process on the presently-exposedapparatus surface 531. The cleaning process implemented on surface 531in FIG. 5D can be similar to the process implemented on surface 511 inFIG. 5B, different, some combination thereof, etc. The cleaning process,when implemented on surface 531, removes 544 at least a portion of theparticles 536, such that surface 531 is cleaned of particles. In theillustrated embodiment of FIG. 5D, the cleaning process which isimplemented comprises a jet of fluid 542, directed by a fluid sourcedevice 540 to impinge on the surface 531, where the fluid 542 carriesthe particles 536 away from surface 531. The fluid 542 can include anyknown cleaning fluid, including one or more solvents, and can includefluid in one or more states, including gaseous, liquid, some combinationthereof, etc.

As shown in FIG. 5D, implementation of the cleaning process on surface531 results in exposing the gap spaces 535A-B. Because the exposed gapspaces expose portions of surface 511, the presently-exposed apparatussurface in FIG. 5D includes the exposed surface 511 and correspondingportions of surface 511 exposed by the gap spaces 535A-B. Asubsequently-applied barrier layer can fill in one or more of the gapspaces, thereby sealing the gap space and precluding environmentalelement permeation through the one or more gap spaces.

FIG. 5E illustrates application of a barrier layer 554 on thepresently-exposed apparatus surface shown in FIG. 5D. A barrier layer554 can be applied via any known barrier layer application process. Theillustrated process shows an applicator 550 providing the material 552of the barrier layer 554 to coat the presently-exposed surface 531, 511to form the layer 554. In some embodiments, the barrier layer includes athin film barrier applied via a “sputtering” process. In someembodiments, the barrier layer includes a thin film barrier applied viaan atomic layer deposition process. Other barrier layer applicationprocesses will be understood to be encompassed.

As shown in FIG. 5E, the applied barrier layer 554 fills in the gapspace 535A. As barrier layer 554, like layer 534, is comprised ofenvironmental element permeation-resistant material, the filling in ofgap space 535A seals the gap space 535A from permitting environmentalelement permeation through the gap space 535A.

As shown in FIG. 5E, although surface 531 was cleaned of particles 536via implementation of a cleaning process in FIG. 5D, so that gap spaces535A-B were exposed, the application of barrier layer 554 at FIG. 5Eresults in a barrier layer 554 which includes particles 556, where theparticles 556 result in defects in the barrier layer 554; specificallygap spaces 545A-B. Such particles 556 can be deposited on the apparatusas a side effect of the application of the barrier layer 554. Inaddition, as shown, one of the gap spaces 545B formed by a particle 556aligns with gap space 535B, such that a permeation pathway from device520 through both layers 534, 554 is present.

As shown in FIG. 5C, application of the barrier layer 534 results in anew presently-exposed surface 551 of the apparatus, where the surface551 includes an exposed surface of the applied barrier layer 554.

FIG. 5F illustrates implementation of a cleaning process on thepresently-exposed apparatus surface 551. The cleaning processimplemented on surface 551 in FIG. 5E can be similar to the processimplemented on surface 511 in FIG. 5B and surface 531 in FIG. 5D,different, some combination thereof, etc. The cleaning process, whenimplemented on surface 551, removes 564 at least a portion of theparticles 556, such that surface 551 is cleaned of particles. In theillustrated embodiment of FIG. 5F, the cleaning process which isimplemented comprises a jet of fluid 562, directed by a fluid sourcedevice 560 to impinge on the surface 551, where the fluid 562 carriesthe particles 556 away from surface 551. The fluid 562 can include anyknown cleaning fluid, including one or more solvents, and can includefluid in one or more states, including gaseous, liquid, some combinationthereof, etc.

As shown in FIG. 5F, implementation of the cleaning process on surface551 results in exposing the gap spaces 545A-B. Because the exposed gapspaces expose portions of surface 531 and surface 511, thepresently-exposed apparatus surface in FIG. 5F includes thecorresponding portions of surfaces 531, 511 exposed by the gap spaces545A-B. A subsequently-applied barrier layer can fill in one or more ofthe gap spaces, thereby sealing the gap space and precludingenvironmental element permeation through the one or more gap spaces.

FIG. 5G illustrates application of a barrier layer 574 on thepresently-exposed apparatus surface shown in FIG. 5F. A barrier layer574 can be applied via any known barrier layer application process. Theillustrated process shows an applicator 570 providing the material 572of the barrier layer 574 to coat the presently-exposed surface, whichincludes surfaces 551, 531, 511 to form the layer 574. In someembodiments, the barrier layer includes a thin film barrier applied viaa “sputtering” process. In some embodiments, the barrier layer includesa thin film barrier applied via an atomic layer deposition process.Other barrier layer application processes will be understood to beencompassed.

As shown in FIG. 5G, the applied barrier layer 574 fills in the gapspaces 545A-B and 535B. As barrier layer 574, like layers 554, 534, iscomprised of environmental element permeation-resistant material, thefilling in of gap spaces 545A-B, 535A seals the gap spaces frompermitting environmental element permeation through the gap space 535A.Furthermore, as shown in FIG. 5G, because all gap spaces exposingsurface 511 are filled, no permeation pathways between surface 511 ofthe device 520 and an external environment are present.

FIG. 5H illustrates cleaning the presently-exposed apparatus surface viaimplementation of a cleaning process on the presently-exposed apparatussurface resulting from the applied barrier layer 574. Thepresently-exposed apparatus surface includes exposed surfaces of layer574 and layer 554. The cleaning process implemented on thepresently-exposed surface in FIG. 5H can be similar to the processimplemented on surface 511 in FIG. 5B and surface 531 in FIG. 5D,different, some combination thereof, etc. The cleaning process, whenimplemented on the surface, removes 584 at least a portion of theparticles 586, such that the surface is cleaned of particles. In theillustrated embodiment of FIG. 5H, the cleaning process which isimplemented comprises a jet of fluid 582, directed by a fluid sourcedevice 580 to impinge on the surface, where the fluid 582 carries theparticles 586 away from the presently-exposed surface. The fluid 582 caninclude any known cleaning fluid, including one or more solvents, andcan include fluid in one or more states, including gaseous, liquid, somecombination thereof, etc.

In some embodiments, the cleaning process illustrated in FIG. 5H can beabsent, at least because no continuous permeation pathways through thestack 590 are present.

FIG. 6 illustrates a partial cross-sectional view of an apparatus whichincludes a multi-layer encapsulation stack which is structured toinclude multiple consecutively-applied permeation-resistant layers withcleaning of the presently-exposed apparatus surface prior to each layerapplication, according to some embodiments. One or more of theapparatus, encapsulation stack, etc. can be included in any of theembodiments herein.

Apparatus 600 includes a substrate 610, a device 620 provided on thesubstrate, and an encapsulation stack 670 applied on the apparatus,where the encapsulation stack 670 is applied to at least asubstrate-distal surface 621 of the device 620.

In some embodiments, an encapsulation stack applied via consecutivebarrier layer applications, where each barrier layer application ispreceded by implementing a cleaning process on the presently-exposedapparatus surface, results in a multi-layer stack where one or moreindividual barrier layers include one or more gap spaces, where the gapspaces are filled by one or more subsequently-applied barrier layers. Asa result, individual defects in individual barrier layers can bemitigated by other barrier layers, such that the multiple barrier layersin the stack do not include a continuous permeation pathway betweenenvironmental-element sensitive portions of the apparatus, including adevice, and an external environment, through the encapsulation stack.Such mitigation can be based at least in part upon implementing acleaning process on the presently-exposed apparatus surface prior toeach barrier layer application, interposed between consecutive barrierlayer applications, some combination thereof, etc.

For example, as shown in FIG. 6, encapsulation stack 670 includes threeseparate and consecutively-applied barrier layers 630, 640, 650, whereeach individual barrier layer includes multiple gap spaces. Layer 630includes three gap spaces 632A-C, layer 640 includes three gap spaces642A-C, and layer 650 includes two gap spaces 652A-B. As shown, theapplied barrier layer 640 fills in the gap spaces 632A-B of layer 630,thereby sealing those gap spaces 632A-B from forming part of a pathwaybetween device 620 and an external environment through the stack 670. Inaddition, layer 650 fills in gap spaces 642A-C of layer 640.

In some embodiments, at least some gap spaces of adjacent barrier layersin an encapsulation stack may align, also referred to herein as the gapspaces of the adjacent barrier layers “overlapping”, such that the gapspaces, if not filled in, can form a continuous permeation pathwaythrough at least the adjacent layers. In some embodiments, theencapsulation stack includes a sufficient number of barrier layers thatthe probability that at least a minimum number of continuous permeationpathways extend through all of the barrier layers in the stack is lessthan a threshold value, for one or more particular confidence levels.For example, in the illustrated embodiment, three barrier layers 630,640, 650 may have been consecutively applied to apparatus 600, withcleaning processes implemented on the presently-exposed apparatussurface prior to each barrier layer application, based on adetermination that, with 95% confidence, the probability that anencapsulation stack which comprises three consecutively-applied barrierlayers will include at least one continuous permeation pathway throughthe stack is less than a threshold value of 1%.

In the illustrated embodiment, although gap spaces 632C and 642C oflayers 630, 640 overlap, the subsequently-applied layer 650 fills inboth gap spaces, thereby sealing the gap spaces 642C, 632C form formingpart of a continuous permeation pathway through all of the layers of thestack 670. While layer 650 may itself include gap spaces 652A-B, none ofthose gap spaces align with any gap spaces of adjacent layers. As aresult, the multiple barrier layers 630, 640, 650 do not include acontinuous permeation pathway through the three layers, therebyrendering the stack 670 independent of any permeation pathway throughthe stack 670.

As shown in FIG. 6, in some embodiments, an applied barrier layer in anencapsulation stack is at least partially conformal, such that a barrierlayer applied over a defect may at least partially follow the contoursof the defect. As shown, portions of barrier layer 640 which fill in gapspaces 632A-B include a respective divot over each filled in gap space.Subsequently-applied layer 650 does not include such a divot over eachof the divots of the previously-applied layer 640.

In some embodiments, an encapsulation stack can include one or moreadditional layers, relative to the multiple consecutively-appliedbarrier layers, which provide properties other than environmentalelement permeation resistance to the encapsulation stack. Suchproperties can include anti-reflection, exposed surface smoothing, etc.Such an additional layer can be applied subsequently to applying themultiple barrier layers, such that any permeation of environmentalelements through the additional layers is restricted from permeatingthrough the entire stack by the multiple barrier layers. In theillustrated embodiment, for example, stack 670 includes an additionalouter layer 660 which fills in the gap spaces 652A-B of layer 650,embeds any particles present on the exposed surface of layer 650, andresults in a smooth exposed surface 661. While layer 660 may be at leastpartially permeable by environmental elements, the multiple barrierlayers 630, 640, 650 restrict the environmental elements from permeatingto the device 620. In some embodiments, layer 660 can include one ormore various materials, including one or more polymer materials, monomermaterials, etc. The layer 660 can include a polymeric material which isthicker relative to the multiple barrier layers in the stack 670, forexample.

FIG. 7A-D illustrate various cleaning processes which can be implementedon a presently-exposed apparatus surface, according to some embodiments.Such cleaning processes can be implemented as part of applying any ofthe embodiments of an encapsulation stack included herein. Thepresently-exposed apparatus surface upon which any of the cleaningprocesses can be implemented can include any of the apparatuses includedin any of the embodiments included herein. In some embodiments,implementing a cleaning process on a presently-exposed apparatus surfaceincludes implementing two or more individual cleaning processes on thepresently-exposed apparatus surface.

Each of the illustrated embodiments in FIG. 7A-D illustrate implementinga cleaning process on a presently-exposed surface 721 of an apparatus700, where the apparatus 700 includes a barrier layer 720 which isapplied to a portion 710 of the apparatus prior to implementation of theillustrated cleaning process on surface 721, where the barrier layer 720includes a gap space 722 formed by a particle 724 which lies at leastpartially within the gap space prior to implementation of any of theillustrated cleaning processes.

FIG. 7A illustrates a cleaning process which includes application of abrush device to the presently-exposed apparatus surface, where the brushdevice removes particles from the surface, exposing gap spaces includedtherein, some combination thereof, etc. based on motion of the brushdevice relative to the apparatus, such that the brush “sweeps” over atleast a portion of the surface area of the surface. As shown, a brushdevice 730 is moved over surface 721, at least partially in physicalcontact with the surface 721, such that at least a portion of the brushdevice 730, when moving over the gap space 722 in which the particle 724lies, removes the particle 724 from the gap space 722. The brush device730 can remove the particle 724 from physical contact with any portionof the apparatus 700. In some embodiments, application of a brush deviceincludes one or more of application of multiple brush devices to moveover various portions of the surface 721, application of multiple brushdevices to move over a common portion of surface 721 in differentdirections relative to surface 721, application of a single brush device730 to move over a common portion of surface 721 in different directionsrelative to surface 721, application of a single brush device 7340 tomove over different portions of the surface 721 in different directionsrelative to surface 721, some combination thereof, etc. In someembodiments, application of a brush device 730 to a surface 721 ofapparatus 700 includes moving the apparatus 700 relative to a brushdevice 730 which is mounted in a fixed position, such that the brushdevice 730 is moved over the surface 721.

FIG. 7B illustrates a cleaning process which includes application of ascrubbing device to the presently-exposed apparatus surface 721, wherethe scrubbing device removes particles from the surface, exposing gapspaces included therein, some combination thereof, etc. based on thescrubbing device scrubbing the surface 721, such that the scrubbingdevice 740 is moved over at least a portion of the surface area of thesurface and removes particles encountered by the device. As shown, ascrubbing device 740 can include a roller device which scrubber heads742, where the device is rotated along its long axis to cause the heads742 to scrub portions of the surface 721. The device 740 can be moveover surface 721, concurrently with the rolling of the device 740, suchthat at least a portion of the heads 742, when moving over the gap space722 in which the particle 724 lies, removes the particle 724 from thegap space 722. The scrubbing device 740 can remove the particle 724 fromphysical contact with any portion of the apparatus 700.

FIG. 7C illustrates a cleaning process which includes application of afluid stream 722 to the presently-exposed apparatus surface 721 of theapparatus, where the fluid stream removes particles 724 from surface721. The fluid stream can be provided by one or more applicators 750,where the applicator 750 can direct a fluid stream 722 to impinge uponthe surface at one or more angles relative to the surface 721. In someembodiments, the fluid stream includes a jet of fluid, such as describedabove with reference to FIG. 5A-H. The fluid can include one or morevarious fluids, including one or more liquids, gases, solids, somecombination thereof, etc. For example, the fluid stream can include astream which includes frozen carbon dioxide, also referred to as carbondioxide “flakes”, dry ice particles, carbon dioxide “snow”, etc. Theapplicator 750 can direct a fluid stream 722 which includes one or moreof solid carbon dioxide, gaseous carbon dioxide, etc. across apresently-exposed surface, where the flakes can remove particles fromthe surface via one or more of exerting aerodynamic drag on theparticles, momentum transfer, dissolving of particles induced via impactstress liquefying the flakes, some combination thereof, etc. In anotherexample, the fluid stream can include a bubble jet stream, which caninclude a mixture of liquid and gaseous materials, substances, etc. in acommon fluid stream. In some embodiments, the fluid 722 includes asolvent fluid which, upon contacting a particle 724, can at leastpartially remove the particle by at least partially breaking down thephysical structure of the particle 724. In some embodiments,implementation of the cleaning process shown in FIG. 7C includes causingthe fluid applicator to be moved, adjusted in orientation, somecombination thereof, etc. relative to surface 721 as the applicator 750applies the fluid stream 722, so that the fluid stream is adjustablydirected over various portions of the surface 721.

FIG. 7D illustrates a cleaning process which includes application offluid droplets to a presently-exposed apparatus surface and applyingsound waves to the surface to cause the droplets to displace a particle724 form the surface. Such displacement can be based on vibration of thedroplets as a result of the applied sound waves, implosion of dropletsas a result of the applied sound waves, some combination thereof, etc.As shown, a fluid droplet applicator 762 can provide droplets 763 to thesurface 721, and a sound wave generator 764 can provide sound waves 765which, upon reaching the droplets 766 resting on the surface 721,disturb 767 the droplets 766 such that the disturbed droplets 767 causethe particle 724 to be displaced from its resting position on surface721, including being displaced from the gap space 722. In someembodiments, the sound waves 765 include ultrasonic sound waves. In someembodiments, the disturbed droplets 767 are droplets which at leastpartially implode as a result of the application of ultrasonic soundwaves 765 on the droplets 766. In some embodiments, the force ofimploding droplets 767 on the particle 724 can force the particle 724 tobe displaced from its resting position in gap space 722. In someembodiments, the generator 764 is a light beam emitter, including alaser beam source, and waves 765 are one or more light beams directed bygenerator 764 onto a presently-exposed surface which induce implosion,also referred to as cavitation, of droplets 767, bubbles, etc. providedonto on the surface.

In some embodiments, cleaning the presently-exposed apparatus surface721 via at least partial implementation of any of the illustratedcleaning processes of FIG. 7A-D, including causing movement, adjustment,operation, some combination thereof, etc. of the various devices 730,740, 750, 762, 764 shown in FIG. 7A-D is controlled by one or morecontrol systems, which can be implemented by one or more computersystems.

FIG. 8 illustrates a partial cross-sectional view of an apparatus whichincludes a substrate and an encapsulation stack applied to a surface ofthe substrate, according to some embodiments. The apparatus 800 can beincluded in any of the embodiments herein.

In some embodiments, at least a portion of an apparatus includes asubstrate, and is absent any provided device, so that the encapsulationstack is applied to a surface of the substrate. In the illustratedembodiment, for example, apparatus 800 includes a substrate 810 with asurface 801, and the encapsulation stack 820, which can include multiplelayers of consecutively-applied barrier layers, can be applied to thesurface 801 of the substrate 810, via consecutive application ofmultiple barrier layers with cleaning processes implemented onpresently-exposed apparatus surfaces prior to each barrier layerapplication.

FIG. 9 illustrates a perspective view of an apparatus which isstructured to be at least partially flexible and includes anencapsulation stack, according to some embodiments. The apparatus 900can be included in any of the embodiments herein.

In some embodiments, an apparatus 900 is structured to at leastpartially flex, relative to a reference plane 950. In some embodiments,the apparatus is structured to flex multiple separate portions of theapparatus in multiple different directions, relative to the plane 950.As shown, apparatus 900 is structured so that one end of the apparatuscan be flexed to at least one angle 942 in a positive direction relativeto the plane 950, while another end of the apparatus is flex to at leastone angle 944 in a negative direction relative to the plane 950. In someembodiments, the apparatus 900 is referred to as an at least partiallyflexible apparatus. As shown, the apparatus 900 can include a substrate910, a device 920 provided on the substrate 910, and an encapsulationstack 930 applied to a substrate-distal surface of the device 920. Theencapsulation stack 930, which can include any of the encapsulationstack embodiments included herein, is structured to flex with theapparatus 900 without failure, degradation, etc. As a result, thevarious barrier layers included in the multi-layer encapsulation stack930 are structured to be flexed.

FIG. 10 illustrates a partial cross-sectional view of an apparatus whichincludes a substrate, a device provided on a portion of the substrateand an encapsulation stack applied to a surface of the apparatus, suchthat the encapsulation stack covers both at least some portions of thedevice and at least some exposed portions of the substrate, according tosome embodiments. The apparatus 900 can be included in any of theembodiments herein.

In some embodiments, an apparatus includes a device which is providedover a limited portion of a substrate, and a multi-layer encapsulationstack, which can include any of the encapsulation stack embodimentsincluded herein, is applied to both the device and at least someportions of the substrate on which the device is not provided. Forexample, as shown in FIG. 10, an apparatus 1000 includes a device 1020provided on a portion of a substrate 1010. The device 1020 can includeany of the devices included in any of the embodiments included herein,including an EC device. As shown, an encapsulation stack 1030 is appliedto the apparatus, where the encapsulation stack 1030 is applied to asubstrate-distal surface of the device 1020, device 1020 surfaces whichextend to the substrate 1010 surface, and portions 1040 of the substrate1010 surface to which the device 1020 is not provided. As a result, someor all of the surfaces of the device 1020 are covered by the stack 1030,restricting environmental element permeation to the device 1020 frommultiple surfaces of the device 1020. In some embodiments, the stack1030 applied to portions 1040 restricts environmental element permeationto substrate 1010, which can protect the substrate against environmentalelement degradation, preclude environmental element permeation to thedevice 1020 via the substrate 1010, some combination thereof, etc.

In some embodiments, an encapsulation layer can include a multi-layerstack which is laminated on top of a surface of an apparatus. Forexample, an encapsulation stack can include multiple barrier layers,which can include a multi-layer stack, which is formed on a substrate,and the substrate can be laminated on a device, which can include an ECfilm stack. The substrate can include a thin glass substrate, polymersubstrate, etc., which is resistant to moisture permeation through thesubstrate. The multi-layer stack can include one or more AR layers, IRcut-off filter layers, etc. In some embodiments, the multi-layer stackis at least partially permeable to moisture, and the substrate on whichthe multi-layer stack is formed is moisture-permeation resistant, so theencapsulation layer which includes the substrate and the multi-layerstack is resistant to moisture permeation. The substrate can belaminated to the EC film stack via one or more various adhesives, one ormore index adaptation layers, etc.

In some embodiments, an apparatus included in one or more of theembodiments included herein comprises a device provided on a substrate,where the device comprises an electrochromic (EC) device. Such a devicecan include a multi-layered device, where the various layers can haveone or more various shapes and sizes. An EC device can include an ECfilm stack and conductive layers on opposite sides of the EC film stack.

FIG. 11 illustrates a perspective view of an ovoid-shaped EC devicewhich is structured to switch between separate transmission patterns, indifferent regions of the EC film stack and is structured to selectivelyheat one or more regions of a conductive layer which corresponds to oneor more of the EC film stack regions, according to some embodiments. ECdevice 1100 includes at least an EC film stack 1102, conductive layers1104, 1106 on opposite sides of EC film stack 1102, and electrodes1108A-B, 1109A-B coupled to separate ones of the conductive layers.

In some embodiments, an EC device is included in one or more portions ofa camera device. The EC device can be structured to switch betweenseparate transmission patterns to augment camera device operations. Forexample, an EC device can be included in a camera aperture device, wherethe EC device is structured to switch between separate transmissionpatterns to selectively apodize the camera aperture. Such an EC devicecan be structured to switch a particular region of the EC device to adifferent transmission level than other regions of the EC device. Such aparticular region, in some embodiments, can be an annular region of theEC device. In some embodiments, where rapid and uniform switching of theparticular region is desired, the EC device is structured to selectivelyheat at least the particular region of the EC device.

In some embodiments, EC device 1100 is included in a camera device andis configured to apodize the light passing through the camera device, sothat less light passes through the periphery of the lens of the camera,relative to the center of the lens. Apodization can include apodizingthe EC device 1100, where the EC device is comprised in the aperture ofthe camera device. Such apodization results in diffusion at the edges ofthe out-of-focus elements captured in an image of a. Such diffusionresults in smoothing of the out-of-focus elements, and enables thesubject to stand out more vividly against the out-of-focus elements.

In some embodiments, apodizing a camera aperture enables augmentedresolution of images by the camera, as the diffraction patterns aroundan image of a subject on a camera sensor may be reduced. For example, anapodized aperture, reducing the amount of light which passes through theperiphery of the lens, can result in an image of a subject where theAiry patterns around the image of the subject are reduced in intensity,if not removed altogether. In addition, sensitivity of the light sensorto aberrations in the lens may be mitigated.

In some embodiments, EC device 1100 is structured to selectively switchseparate EC regions between separate transmission levels, so that the ECdevice can selectively apodize one or more of the aperture, lens, etc.of a camera device.

In the illustrated embodiment, for example, EC device 1100 has an ovoidshape, which can include a circular shape, and is structured to switchthe EC film stack 1102 between at least two transmission levels, so thata particular annular region 1114 of the EC device 1100 switches to alesser transmission level than remainder regions 1112, 1116. Suchstructuring can include variations in resistance in one of theconductive layers which corresponds to the region 1114, to structure theelectrical potential difference across a corresponding region of the ECfilm stack to be greater than across EC regions corresponding to regions1112, 1116. Such structuring can include variations in ion mobility inone or more layers in the EC film stack in regions which correspond toregions 1112, 1114, 1116. Electrodes 1108A-B, 1109A-B can be structured,as shown, to follow the curvature of the EC device 1100 to promoteincreased uniformity of charge distribution throughout the EC device1100, relative to some embodiments where the electrodes extend straight,relative to the curvature of the layers 1102, 1104, 1106.

In some embodiments, various quantities of sets of electrodes arecoupled to one or more of the conductive layers in an EC device. Theseparate conductive layers can include different quantities of sets ofelectrodes coupled to the respective conductive layer. For example,conductive layer 1106 can include a single set of two electrodes1109A-B, while conductive layer 1104 can include two sets of twoelectrodes each, for a total of four electrodes coupled to layer 1104. Agiven set of electrodes can include two or more electrodes which arecoupled to different regions of a conductive layer. In one example,including as shown in FIG. 11, the separate electrodes 1109A-B in a setof electrodes can be coupled to opposite edges of a conductive layer. Itwill be understood that a set of electrodes can be coupled to differentregions of a layer, where the different regions are not opposite edgesof the conductive layer. In some embodiments, where multiple sets ofconductive layers are coupled to a conductive layer, one or more sets ofelectrodes can be structured to be used to induce an electricalpotential difference between the separate conductive layers, and acrossthe EC film stack, to cause the EC film stack to switch transmissionpatterns, while a separate one or more sets of electrodes can bestructured to be used to induce a current, electrical potentialdifference, etc. across the conductive layer to cause selective heatingof one or more particular limited regions of the conductive layer. Insome embodiments, separate electrodes coupled to a conductive layer arespaced uniformly around the one or more edges of the conductive layer,so that current induced between the separate electrodes is substantiallymore uniform than if the electrodes are not uniformly spaced. Suchaugmented uniformity of current distribution through the layer canaugment the uniformity of switching of corresponding EC film stackregions, uniformity of heating of various conductive layer regions, etc.As shown in FIG. 11, electrodes coupled to an ovoid or circularconductive layer can be coupled to different regions of the layer sothat the sets of electrodes approximate a circular electrode around theedge of the conductive layer. Where additional sets of electrodes arecoupled to a conductive layer, e.g., two sets of two electrodes each,the electrodes in the sets may be spaced equidistantly around thecircumference of the conductive layer, where the electrodes are coupledaround the circumference in alternating sets of electrodes. It will beunderstood that the disclosed conductive layers and electrodes coupledthereto encompass any number of sets of electrodes coupled to the layer,number of electrodes per set coupled to the layer, arrangement ofelectrodes coupled to the layer, number of electrodes, sets thereof,etc. coupled to different conductive layers on opposite sides of an ECfilm stack in an EC device, etc. For example, EC device 1100 can includeeight electrodes coupled to the conductive layers 1104, 1106, where twosets of two electrodes each, for a total of four electrodes, are coupledto layer 1104 and equidistantly spaced around the circumference of thelayer 1104, while two sets of two electrodes each, for a total of fourelectrodes, are coupled to layer 1106 and equidistantly spaced aroundthe circumference of the layer 1106.

In some embodiments, an apparatus, including the one or more of thevarious apparatuses illustrated and discussed above, is structured torestrict environmental element permeation between the EC film stack ofan EC device and an external environment.

In some embodiments, an environmental element-resistant, also referredto herein as “passivated”, apparatus includes a single substrate, uponwhich a plurality, or stack, of layers of the EC device are provided. Asingle substrate may be used to limit the thickness of the overallapparatus. The plurality of layers may be structured to restrictmoisture permeation between the EC film stack and an externalenvironment. Such structuring of an apparatus may be referred to as“passivating” the apparatus, and an apparatus structured to restrictmoisture permeation between the EC film stack and the externalenvironment may be referred to as a “passivated” apparatus.

Such structuring or “passivating” can include providing, in theplurality of layers of the apparatus, at least one encapsulation stack.An encapsulation stack is resistant to moisture permeation, and the atleast one encapsulation stack can extend over various layers in the ECdevice to cover various portions of various layers, including edgeportions, from being exposed to the external environment. In someembodiments, an encapsulation stack includes one or more of ananti-reflective (AR) layer, infrared cut-off filter (IR cut) layer, sothat the encapsulation stack is structured to simultaneously blockmoisture and perform one or more various functions of the EC device,including mitigating reflection where the layer includes an AR layer. Insome embodiments, an EC device includes a protonic device which includeswater used to enable ions to move between layers. An encapsulation stackcan at least partially restrict the water in the protonic device fromleaving the device and entering an external environment.

In some embodiments, an apparatus includes at least one encapsulationstack and one or more conductive layers which collectively restrictmoisture permeation between the EC film stack and the externalenvironment. Providing an encapsulation layer alone on a plurality oflayers of an EC device may, in some embodiments, be insufficient topreclude environmental element permeation between the EC film stack andthe external environment, as exposed edge portions of the EC devicelayers can transport at least some environmental elements. Structuringthe apparatus so that the only exposed edge portions of layers in theplurality of layers include the at least one encapsulation layer and oneor more conductive layers, where the exposed edge portions of theconductive layers resist moisture permeation, can result in a passivatedEC device. In some embodiments, a conductive layer includes one or moretransparent conductive layers, also referred to as transparentconducting oxides (TCOs) which resist moisture permeation. As a result,the conductive layers can extend to the edges and be exposed to theexternal environment at one or more edge portions, while the EC filmstack remains covered from the external environment.

In some embodiments, a conductive layer includes multiple elements,including an environmental element permeation-resistant outer portionand an environmental element—transporting inner portion which is coveredfrom exposure to the external environment by the outer portion. Forexample, the conductive layer may include an inner transparentconducting oxide portion which transports moisture, and one or moreouter non-transparent conducting portion which resists moisturepermeation. The outer portion may be exposed to the externalenvironment, enabling the transparent conducting oxides to be protectedfrom environmental element permeation.

In some embodiments, a passivated apparatus includes one or more sets ofbus bars which are structured to cause the EC device to switch betweenseparate transmission states with uniform and symmetrical radial opticaldensity distribution. Each set of bus bars can include a bus bar coupledto one of the conductive layers of the EC device, on a first side of thedevice, and another bus bar coupled to another one of the conductivelayers on an opposite side of the device. The separate bus bars in theset may be structures to extend uniformly in spacing from each other.Where the EC device is circular, the bus bars in a set may be curved toextend at a fixed distance from each other.

In some embodiments, an apparatus includes multiple separateencapsulation stacks, including a top encapsulation stack which islocated between the EC film stack and an external environment and abottom encapsulation stack which is located between the EC film stackand the substrate. A bottom encapsulation stack may be present where thesingle substrate transports moisture. Where the single substrate isstructured to resist moisture permeation, the bottom encapsulation stackmay be absent from the apparatus. In some embodiments, an apparatusincludes one or more substrates.

As referred to herein, a substrate included in an apparatus can compriseone or more of various materials. The substrate can include one or morevarious transparent materials, including one or more glasses,crystalline materials, polymer materials, monomer materials, somecombination thereof, etc. Crystalline materials can include one or moreof Sapphire, Germanium, Quartz, Silicon, etc. Polymer materials caninclude one or more of PC, PMMA, PET, PEN, Fluor polymers, Kapton, etc.In some embodiments, a substrate can include ultra-thin glass (UTG). Forexample, a substrate can include one or more of Willow™ glass, AF 32®eco thin glass, D263® T thin glass, G-Leaf™ flexible glass, somecombination thereof, etc. A substrate can include one or more thermallytempered materials, chemically tempered materials, etc. For example, asubstrate can include GORILLA GLASS™. In another example, a substratecan include thermally-strengthened glass. In another example, Asubstrate can include materials having one or more various thermalexpansion coefficients, including one or more of low CTE (coefficient ofthermal expansion) glass, high CTE glass, some combination thereof, etc.In another example, a substrate can include one or more of a chemicallystrengthened glass, chemically tempered glass, including GORILLA GLASS™chemically tempered borosilicate glass, etc. In some embodiments, asubstrate includes one or more of a transparent or reflective material,including a material which can reflect at least one wavelength of theelectromagnetic spectrum. A substrate can have one or more variousthicknesses. For example, a substrate can have one or more thicknessesbetween 1 to 100 microns thick, inclusively. A substrate can include oneor more of an IGU, TGU, laminate, monolithic substrate, etc.

FIG. 12A-B illustrate an apparatus 1200 which comprises an EC device, anencapsulation stack 1270 provided on the EC device, and one or more sets1280, 1282 of bus bars coupled to the EC device, according to someembodiments, so that one set of bus bars 1280 couples to at least anouter portion 1284 of a bottom conductive layer 1208 and another set ofbus bars 1282 couples to an outer portion of a top conductive layer1240. The apparatus 1200 can be included in any of the embodimentsincluded herein. For example, the encapsulation stacks 1270, 1204 caneach include a multi-layer encapsulation stack comprising multipleconsecutively-applied barrier layers, where each barrier layerapplication is preceded by a separate cleaning process implemented on apresently-exposed surface.

As shown, in some embodiments a top encapsulation stack 1270 is providedover a portion of the EC device, so that the top encapsulation stackcovers one or more exposed edge portions 1252 of the EC film stacklayers 1210, 1220, thereby completing an isolation of the edge portionsof the EC film stack layers 1210, 1220 from the external environment.

In some embodiments, the outer portions 1284, 1286 of the conductivelayers is a separate material from the remainder of the respectivelayers 1208, 1240. For example, outer portions 1284, 1286, which areexposed to the external environment, may comprise non-transparentconducting material which resists moisture permeation, while theremainder of the layers 1208, 1240 comprises a transparent conductingmaterial, including TCO, which transports moisture. As a result, theouter portions 1284, 1286 of the conductive layers collectively, withthe encapsulation stacks 1270, 1206, preclude environmental elementpermeation between the external environment and the EC film stack layers1210, 1220. The illustrated top encapsulation stack is minimallysufficient to complete the isolation of the EC film stack layers 1210,1220, so that the various encapsulation stacks 1206, 1270 and conductivelayers 1208, 1240 collectively isolate the EC film stack layers 1210,1220, so that environmental element permeation between the EC film stacklayers and the external environment is restricted.

As shown, FIG. 12B shows two different cross sections “A” and “A′” ofthe apparatus 1200, where the cross sections A and A′ are perpendicularto each other. As a result, the first side of the apparatus 1200 is90-degrees offset from the second side of the apparatus 1200.

As noted above, the top encapsulation stack 1270 can include one or moreof an AR layer, IR cut layer, etc. In some embodiments, theencapsulation stack 1270 includes a dense multilayer structure (e.g., upto 100 layers) of alternating high refractive index materials and lowrefractive index materials. Each of the alternating layers may be up to5 microns thick. In some embodiments, the top encapsulation stack 1270covers the EC film stack layers, conductive layers, and bus bars. Due tothe thick multilayer structure of an encapsulation, the encapsulationstack may reduce environmental element permeation so that the EC filmstack is sufficiently protected and does not require a top substrate torestrict environmental element permeation.

II. Encapsulation Stack Application

FIG. 13 illustrates an apparatus fabrication system 1300 which includesan encapsulation stack application system, according to someembodiments. The system can fabricate any of the apparatuses included inany of the embodiments included herein.

Fabrication system 1300 includes a device provision system 1310 which isstructured to receive an apparatus 1301 which comprises a substrate1302. The system 1310 is structured to provide at least one device 1303on at least one surface of the substrate 1302, such that the system 1310provides an apparatus 1301 which is modified such that the apparatus1301 includes a substrate 1302 and at least one device 1303 provided onat least one surface of the substrate. As referred to herein, a deviceprovided on a substrate can include a device deposited on the substrate.In some embodiments, a device is provided on a substrate via one or moreprocesses separate from deposition including, for example, adhesion tothe substrate via one or more adhesives.

Fabrication system 1300 includes an encapsulation stack applicationsystem 1320 which is structured to receive the apparatus 1301 whichcomprises the substrate 1302 and provided device 1303. System 1320 isstructured to apply a multi-layer encapsulation stack to the apparatus1301, such that the system 1320 provides an apparatus 1301 whichincludes the multi-layer encapsulation stack 1305 applied to at leastone apparatus surface 1301. As shown, where the apparatus 1301 includesa device 1303 which is applied to a limited portion of a substrate 1302,the system 1320 can apply the encapsulation stack 1305 to both one ormore surfaces of the device 1303 and one or more portions of thesubstrate to which the device 1303 is not provided. As discussed furtherbelow, the system 1320, in applying the stack 1305 to the apparatus1301, can apply multiple consecutive barrier layers to the apparatus andprecede each barrier layer application with cleaning a presently-exposedapparatus surface, interpose consecutive barrier layer applications withcleaning a presently-exposed apparatus surface, some combinationthereof, etc.

In some embodiments, system 1300 includes a control system 1330 which iscommunicatively coupled to at least a portion of one or more of thesystem 1310. The control system 1330, which can be implemented by one ormore computer systems, can control one or more devices included in oneor more of the systems 1310, 1320.

FIG. 14 illustrates the encapsulation stack application system 1320,shown in FIG. 13, which applies multiple barrier layers on the apparatuswith preceding cleaning of the presently-exposed surface, according tosome embodiments. The system can apply any of the encapsulation stacksincluded in any of the embodiments included herein.

System 1320 receives an apparatus 1400 which includes a substrate 1401and a device 1403 provided on at least a portion of the substrate. Asshown, the apparatus can include at least some particles 1412 which canbe present on a presently-exposed surface 1413 of the apparatus 1400,where the presently-exposed apparatus surface 1413 includes an exposedsurface of the device 1403 and exposed surfaces of the substrate 1401.

System 1320 includes an apparatus cleaning device 1420 which can becontrolled to clean the presently-exposed apparatus surface 1413,thereby removing particles 1412 on the surface 1413. In the illustratedembodiment, device 1420 includes a fluid stream applicator 1421 whichprovides a fluid stream 1422 which impinges on the surface 1413 andremoves the particles 1412 on the surface 1413. It will be understoodthat, to clean the presently-exposed apparatus surface, the cleaningdevice 1420 can be structured to implement any of the cleaning processesincluded herein. Cleaning device 1420 can be controlled to controllablydirect, move, reorient, etc. the fluid stream 1422, via control of theapplicator 1421, thereby implementing a cleaning process on the surface1413.

System 1320 includes a barrier layer application device 1430 which canbe controlled to apply a barrier layer 1405 on the presently-exposedapparatus surface 1413. The resulting apparatus 1400 includes apresently-exposed apparatus surface 1433 which comprises an exposedsurface of layer 1405. As shown, the application of the barrier layer1405 is implemented by an applicator 1431 of device 1430, where theapplicator 1431 provides material 1432 which forms the layer 1405 on thesurface 1413. Various embodiments of the device 1430 can be structuredto apply the barrier layer 1405 via one or more various applicationprocesses, including any of the application processes encompassedherein. As also shown, the application of the barrier layer 1405 canresult in particles 1434 being present on or at least partially withinthe layer 1405, such that the particles 1434 cause the formation of gapspaces extending through some or all of the thickness of the layer 1405.As shown, the illustrated particles 1434 cause the formation of twocorresponding gap spaces which extend through the entirety of the layer1405 thickness. Such particles can be provided as a side-effect of theapplication of the barrier layer by device 1430, as a side effect of laxcleanliness requirements in and around device 1430, some combinationthereof, etc. Barrier application device 1430 can be controlled tocontrollably direct, move, reorient, etc. the applicator 1431, therebyimplementing the application of the barrier layer 1405 on surface 1413.

As shown, system 1320 can include a sensor device 1440 which can observethe apparatus, concurrently with application of the barrier layer 1405,and monitor for defects in the applied barrier layer. In someembodiments, the sensor device 1440 comprises a camera device whichgenerates image data associated with the presently-exposed surface 1433subsequent to barrier layer 1405 application, where the image data canbe used to determine a number, distribution, size, etc. of gap spaces inthe layer 1405. Sensor data generated by the sensor device 1440,including image data, can be used to determine how many barrier layersto apply to the apparatus, whether to apply one or reo additional layersto surface 1433, some combination thereof, etc.

System 1320 includes an apparatus cleaning device 1450 which can becontrolled to clean the presently-exposed apparatus surface 1433,thereby removing particles 1434 on the surface 1433. In the illustratedembodiment, device 1450 includes a fluid stream applicator 1451 whichprovides a fluid stream 1452 which impinges on the surface 1433 andremoves the particles 1434 on the surface 1413. It will be understoodthat the cleaning device 1450, to clean the presently-exposed apparatussurface 1433, can be structured to implement any of the cleaningprocesses included herein. Cleaning device 1450 can be controlled tocontrollably direct, move, reorient, etc. the fluid stream 1452, viacontrol of the applicator 1421, thereby implementing a cleaning processon the surface 1433.

As shown, implementation of the cleaning process by device 1450 resultsin the presently-exposed surface 1433 including an exposed surface oflayer 1405 and exposed surfaces of the device 1403, through the gapspaces exposed via removal of the particles 1434.

System 1320 includes a barrier layer application device 1460 which canbe controlled to apply a barrier layer 1407 on the presently-exposedapparatus surface 1433. The resulting apparatus 1400 includes apresently-exposed apparatus surface 1463 which comprises an exposedsurface of layer 1407. As shown, the application of the barrier layer1407 is implemented by an applicator 1461 of device 1460, where theapplicator 1461 provides material 1462 which forms the layer 1407 on thesurface 1433. Various embodiments of the device 1460 can be structuredto apply the barrier layer 1407 via one or more various applicationprocesses, including any of the application processes encompassedherein. As also shown, the application of the barrier layer 1405 canresult in particles being present on or at least partially within thelayer 1407, such that the particles cause the formation of gap spacesextending through some or all of the thickness of the layer 1407. Asshown, the illustrated particles cause the formation of twocorresponding gap spaces which extend through the entirety of the layer1407 thickness. Such particles can be provided as a side-effect of theapplication of the barrier layer by device 1460, as a side effect of laxcleanliness requirements in and around device 1460, some combinationthereof, etc. Barrier application device 1460 can be controlled tocontrollably direct, move, reorient, etc. the applicator 1461, therebyimplementing the application of the barrier layer 1407 on surface 1433.

As shown, the application of barrier layer 1407 by device 1430 resultsin a barrier layer 1407 which fills in at least some of the gap spacesin the previously-applied layer 1405. As shown, although barrier layer1407 includes gap spaces, barrier layer 1407 fills in the gap spaces oflayer 1405, thereby precluding a continuous permeation pathway throughan encapsulation stack which includes the layers 1405, 1407.

As shown, system 1320 can include a sensor device 1470 which can observethe apparatus, concurrently with application of the barrier layer 1407,and monitor for defects in the applied barrier layer. In someembodiments, the sensor device 1470 comprises a camera device whichgenerates image data associated with the presently-exposed surface 1463subsequent to barrier layer 1407 application, where the image data canbe used to determine a number, distribution, size, etc. of gap spaces inthe layer 1407. Sensor data generated by the sensor device 1470,including image data, can be used to determine how many barrier layersto apply to the apparatus, whether to apply one or reo additional layersto surface 1463, some combination thereof, etc.

As shown, system 1320 can include a loop system 1480 where apparatus1400 is redirected, subsequent to application of layer 1407 by device1460, to cleaning device 1450, where the presently-exposed apparatussurface 1463 can be cleaned, and the apparatus 1400 can then be movedback to device 1460, where device 1460 can apply another barrier layerto the surface 1463 of apparatus 1400. In some embodiments, whether thedevice 1400 is directed on the loop 1480 or is directed out of thesystem can be based on sensor data generated at one or more of sensors1440, 1470. For example, based on a determination that one or morecontinuous permeation pathways through layers 1405 and 1407 is present,apparatus 1400 can be directed along loop 1480 to device 1450, so thatapparatus 1400 receives another cleaning and subsequent barrier layerapplication on a presently-exposed apparatus surface by devices 1450,1460. Upon a determination, based on sensor data, that no continuouspermeation pathways are present, apparatus 1400 can be directed out ofthe system 1320.

As shown, a control system 1410 can be communicatively coupled to thevarious devices of system 1320. System 1410, which can be implemented byone or more computer systems and can be included in system 1330 shown inFIG. 13, can control one or more of the devices 1420-1460, and cancontrol whether apparatus 1400 is directed along loop 1480 one or moretimes, such that control system 1410 can control one or more cleaningprocess implementations on a presently-exposed apparatus surface 1400,control one or more barrier layer applications on a presently-exposedapparatus surface, some combination thereof, etc.

FIG. 15 illustrates a control system which is structured to controlencapsulation stack application to an apparatus, according to someembodiments. The control system 1500 can be included in one or more ofthe control systems disclosed herein, including encapsulation stackapplication system 1320 illustrated in FIG. 13. The control system 1500can be implemented by one or more computer systems, including thecomputer system illustrated in FIG. 17. Control system 1500 includesvarious modules structured to implement various aspects of the controlsystem 1500.

Control system 1500 includes a barrier layer application control module1502. The module 1502 can control a barrier layer applicator, includingany of the devices, applicators, etc. illustrated and discussed herein,to controllably apply a barrier layer to a presently-exposed apparatussurface. In some embodiments, module 1502 controls multiple separatebarrier layer applicators, where each separate applicator applies aseparate barrier layer, of a plurality of consecutively-applied barrierlayers, to a presently-exposed apparatus surface. In some embodiments,module 1502 commands a given applicator to apply a barrier layer to anexposed apparatus surface based on a determination that the apparatus islocated within a certain physical region relative to the applicator. Insome embodiments, module 1502 commands a given applicator to apply abarrier layer to a presently-exposed apparatus surface based on adetermination that a probability of the presence of a pathway between anenvironmental element-sensitive portion of the apparatus and an externalenvironment, at one or more particular confidence levels, exceeds acertain threshold. In some embodiments, module 1502 commands a givenapplicator to apply a barrier layer to a presently-exposed apparatussurface based on a determination, based on observation of the exposedsurface, that one or more gap spaces are present in the exposed surface.In some embodiments, module 1502 can control a process pathway throughwhich a given apparatus is directed, such that module 1502 can redirecta given apparatus to an applicator such that additional barrier layersare applied to the apparatus, an exit of the encapsulation stackapplication system, etc. based on the determined probability,observation of the apparatus, some combination thereof, etc.

Control system 1500 includes a cleaning control module 1504. The module1504 can control one or more devices, applicators, etc. illustrated anddiscussed herein, to controllably clean a presently-exposed apparatussurface by the apparatus surface cleaner device. In some embodiments,module 1504 controls multiple separate cleaner devices, where eachseparate cleaner device implements separate cleanings of thepresently-exposed apparatus surface prior to separate barrier layerapplications, between separate consecutive barrier layer applications,some combination thereof, etc. In some embodiments, module 1504 commandsa given cleaner device to clean a presently-exposed apparatus surfacebased on a determination that the apparatus is located within a certainphysical region relative to the apparatus surface cleaner device. Insome embodiments, module 1504 commands a given cleaner device to clean apresently-exposed apparatus surface based on a determination that one ormore particles are present on the presently-exposed apparatus surface.As referred to herein, a particle “on” an exposed surface of a barrierlayer can be at least partially “in” the barrier layer, and a particlewhich is at least partially within a barrier layer can be at leastpartially “on” an exposed surface of the barrier layer.

Control system 1500 includes a pathway modeling module 1506. The module1506 can determine a probability, at one or more particular confidencelevels, that a given encapsulation stack, comprising a certain number ofbarrier layers, with one or more barrier layers comprising one or moretypes of barrier layer comprising one or more materials, is independentof (i.e., does not include) any continuous permeation pathways betweenenvironmental element-sensitive portions of the apparatus and anexternal environment via the encapsulation stack. Such a determinationcan be based on various factors, which can include the various types ofbarrier layers included in the stack, the materials included in thevarious layers, the number of barrier layers in the stack, the size,shape, area, etc. of the stack, the one or more cleaning processesimplemented on a presently-exposed apparatus surface prior to one ormore of the barrier layer applications, some combination thereof, etc.In some embodiments, at least some of the factors are provided to module1506 via data input received from one or more external sources. In someembodiments, at least some of the factors are provided to module 1506based on observation of the apparatus via one or more sensor devices. Insome embodiments, based on the provided factors associated with anapparatus, module 1506 determines a particular number of barrier layersincluded in an encapsulation stack for which the probability of acontinuous permeation pathway through the stack, at a certain confidencelevel, is less than a certain threshold. In some embodiments, based onthe provided factors associated with an apparatus, module 1506determines a particular number of barrier layers included in anencapsulation stack for which the probability that the encapsulationstack is independent of any continuous permeation pathways through thestack, at a certain confidence level, exceeds a certain threshold. Insome embodiments, based on the determined particular number of barrierlayers, modules 1502, 1504 collectively implement application of theparticular number of barrier layers to the apparatus, such that theapparatus includes an encapsulation stack which comprises at least theparticular number of barrier layers.

Control system 1500 includes an exposed surface observation module 1508.Module 1508 can observe an apparatus at one or more stages in theencapsulation stack application process, including observing theapparatus concurrently with, subsequently to, prior to, some combinationthereof, etc. with regard to one or more barrier layer applications,cleaning process implementations, etc. with regard to an apparatus. Suchobservation of an apparatus can be based on sensor data generated at oneor more sensor devices. Such sensor devices can include one or morecamera devices, light beam scanning devices, etc. Based on suchobservation, module 1508 can determine the presence, location, size,quantity, some combination thereof, etc. of particles on an exposedapparatus surface, the presence, location, size, quantity, somecombination thereof, etc. of gap spaces present in an exposed apparatussurface, etc. Based on one or more of such determinations module 1508can determine whether to direct a given apparatus to receive additionalcleaning, barrier layer application, etc.; whether to direct a givenapparatus to exist an encapsulation stack application system, somecombination thereof, etc.

FIG. 16A illustrates applying a multi-layer encapsulation stack,according to some embodiments. The application illustrated in FIG. 16Acan be implemented by one or more control systems, which can beimplemented by one or more computer systems.

At 1602, an apparatus is received. The apparatus can include one or moreof a substrate, one or more devices provided on one or more surfaces ofthe substrate, etc. For example, a received apparatus can include asubstrate and an OLED device which is provided on a surface of thesubstrate.

At 1603, a particular number of barrier layers to be included in anapplied encapsulation stack is determined. As is discussed further belowwith reference to FIG. 16B, the determination can include determining aparticular number of barrier layers to consecutively apply, such that aprobability that the multiple consecutively-applied barrier layerscollectively include no more than a particular number of continuouspermeation pathways, at a particular confidence level, is less than aparticular threshold probability value.

At 1604, a presently-exposed apparatus surface is at least partiallycleaned. Such cleaning can include implementing one or more cleaningprocesses on the presently-exposed apparatus surface. Thepresently-exposed surface can include one or more surfaces of one ormore previously-applied barrier layers, one or more gap spaces in one ormore previously-applied layers, an exposed surface of a device, anexposed surface of a substrate, some combination thereof, etc. Theimplemented cleaning processes can include one or more of any of thecleaning processes encompassed herein.

At 1606, a barrier layer is applied to the presently-exposed apparatussurface. The barrier layer can include any of the various barrier layersencompassed herein and can be applied via any of the various barrierlayer application processes encompassed herein, including, withoutlimitation, a thin film barrier applied via a sputtering applicationprocess, a thin film barrier applied via an atomic layer depositionprocess, etc.

At 1608, a determination is made regarding whether the number of barrierlayers applied to the received apparatus equals the determinedparticular number of barrier layers. If so, the process ends. If not,additional cleanings and barrier layer applications 1604, 1606 areimplemented until the number of applied barrier layers matches thedetermined particular number. Each subsequent cleaning process 1604implemented can include one or more different cleaning processesrelative to a previously-implemented cleaning process. Each subsequentbarrier layer application 1606 can include applying a different barrierlayer relative to a previously-applied barrier layer, applying a barrierlayer via a different application process relative to the previousbarrier layer application, some combination thereof, etc.

FIG. 16B illustrates determining a particular number of barrier layersto apply to establish a multi-layer encapsulation stack, according tosome embodiments. Determination of a particular “number” of barrierlayers can also be referred to as determination of a particular“quantity” of barrier layers. The determination illustrated in FIG. 16Bcan be implemented by one or more control systems, which can beimplemented by one or more computer systems. As shown, the determinationis included in the determination 1603 illustrated in FIG. 16A.

At 1621, one or more sets of apparatus factors are received. Suchfactors are used as part of determining a probability that one or morecontinuous permeation pathways are present through an encapsulationstack which includes a particular number of barrier layers. Suchapparatus factors can include the surface area of the apparatus coveredby the encapsulation stack, estimated cleanliness of the area in whichbarrier layers are applied (e.g., a particular number of particles, at acertain particle size, per cubic meter of volume in the area), etc.

At 1623, one or more sets of encapsulation stack factors are received.Such factors are used as part of determining the probability, asdescribed above. Such encapsulation stack factors can include one ormore of the materials included in each of the layers to be applied, thesurface area of the apparatus covered by each of the layers, theestimated distribution and size of particles present on an exposedsurface preceding and following each barrier layer application, anestimated number, distribution, and size of gap spaces present in eachindividual barrier layer upon application of the given barrier layer,some combination thereof, etc.

At 1625 and 1627, a particular probability confidence level andthreshold value is determined. The determined threshold value indicatesthe threshold acceptable probability of the presence of no more than acertain number of continuous permeation pathways through theencapsulation stack. The certain number of continuous permeationpathways can be predetermined, and can be determined such that thethreshold probability is a probability that the encapsulation stackincludes no continuous permeation pathways through the barrier layers ofthe stack.

At 1629, the particular number of barrier layers to consecutively apply,such that a probability that the multiple consecutively-applied barrierlayers collectively include no more than a particular number ofcontinuous permeation pathways, at a particular confidence level, isless than a particular threshold probability value, is determined. Thedetermination can include applying the received factors, confidencelevel, and threshold value to a model which determines the probabilitythat an encapsulation stack includes no more than the certain number ofcontinuous permeation pathways, at the determined confidence level as afunction of at least the number of barrier layers included in theencapsulation layer. The particular number of layers can be determinedby solving the model, which can include determining the minimum numberof barrier layers at which the probability is less than the probabilitythreshold.

In some embodiments, the above probability is a probability that theencapsulation layer is free from including any more than a certainnumber of continuous permeation pathways, and the threshold value is athreshold probability that the encapsulation layer, including aparticular number of barrier layers, is free from including any morethan a certain number of continuous permeation pathways.

Based on one or more of the factors, a probability can be determined, atone or more confidence levels, that an encapsulation stack comprising agiven number of barrier layers will not include any pathways forenvironmental element permeation through the stack, via gap spaces inthe various barrier layers. The particular number of layers can bedetermined based on a minimum number of layers at which the determinedprobability, at a particular confidence level, that the resultingencapsulation stack includes at least a certain minimum number ofpathways through the stack is less than a threshold value. In anotherexample, the particular number of layers can be determined based on aminimum number of layers at which the determined probability, at aparticular confidence level, that the resulting encapsulation stackincludes no more than a certain minimum number of pathways through thestack is greater than a threshold value.

FIG. 17 is a block diagram illustrating an example computer system thatmay be used in some embodiments.

In some embodiments, a system that implements a portion or all of one ormore of the technologies, including but not limited to a portion or allof a control system structured to control at least application of amultiple-layer encapsulation stack on an apparatus, where at least onecleaning process precedes each application of each barrier layer in thestack, interposes consecutive barrier layer applications, etc., anend-user device which includes an apparatus which includes a multi-layerencapsulation stack, and various methods, systems, components, devices,and apparatuses as described herein, may include a general-purposecomputer system that includes or is configured to access one or morecomputer-accessible media, such as computer system 1700 illustrated inFIG. 17. In the illustrated embodiment, computer system 1700 includesone or more processors 1710 coupled to a system memory 1720 via aninput/output (I/O) interface 1730. Computer system 1700 further includesa network interface 1740 coupled to I/O interface 1730.

In various embodiments, computer system 1700 may be a uniprocessorsystem including one processor 1710, or a multiprocessor systemincluding several processors 1710 (e.g., two, four, eight, or anothersuitable number). Processors 1710 may be any suitable processors capableof executing instructions. For example, in various embodiments,processors 1710 may be general-purpose or embedded processorsimplementing any of a variety of instruction set architectures (ISAs),such as the x86, PowerPC, SPARC, or MIPS ISAs, or any other suitableISA. In multiprocessor systems, each of processors 1710 may commonly,but not necessarily, implement the same ISA.

System memory 1720 may be configured to store instructions and dataaccessible by processor(s) 1710. In various embodiments, system memory1720 may be implemented using any suitable memory technology, such asstatic random access memory (SRAM), synchronous dynamic RAM (SDRAM),nonvolatile/Flash-type memory, or any other type of memory. In theillustrated embodiment, program instructions and data implementing oneor more desired functions, such as a portion or all of a control systemstructured to control at least application of a multiple-layerencapsulation stack on an apparatus, where at least one cleaning processprecedes each application of each barrier layer in the stack, interposesconsecutive barrier layer applications, etc., an end-user device whichincludes an apparatus which includes a multi-layer encapsulation stack,and various methods, systems, components, devices, and apparatuses asdescribed herein, are shown stored within system memory 1720 as code1725 and data 1726.

In one embodiment, I/O interface 1730 may be configured to coordinateI/O traffic between processor 1710, system memory 1720, and anyperipheral devices in the device, including network interface 1740 orother peripheral interfaces. In some embodiments, I/O interface 1730 mayperform any necessary protocol, timing or other data transformations toconvert data signals from one component (e.g., system memory 1720) intoa format suitable for use by another component (e.g., processor 1710).In some embodiments, I/O interface 1730 may include support for devicesattached through various types of peripheral buses, such as a variant ofthe Peripheral Component Interconnect (PCI) bus standard or theUniversal Serial Bus (USB) standard, for example. In some embodiments,the function of I/O interface 1730 may be split into two or moreseparate components, such as a north bridge and a south bridge, forexample. Also, in some embodiments some or all of the functionality ofI/O interface 1730, such as an interface to system memory 1720, may beincorporated directly into processor 1710.

Network interface 1740 may be configured to allow data to be exchangedbetween computer system 1700 and other devices 1760 attached to anetwork or networks 1750, such as other computer systems or devices asillustrated in FIGS. 1 through 16A-B for example. In variousembodiments, network interface 1740 may support communication via anysuitable wired or wireless general data networks, such as types ofEthernet network, for example. Additionally, network interface 1740 maysupport communication via telecommunications/telephony networks such asanalog voice networks or digital fiber communications networks, viastorage area networks such as Fibre Channel SANs, or via any othersuitable type of network and/or protocol.

In some embodiments, system memory 1720 may be one embodiment of acomputer-accessible medium configured to store program instructions anddata for implementing embodiments of methods as described above relativeto FIGS. 1 through 16A-B. In other embodiments, program instructionsand/or data may be received, sent or stored upon different types ofcomputer-accessible media. Generally speaking, a computer-accessiblemedium may include non-transitory storage media or memory media such asmagnetic or optical media, e.g., disk or DVD/CD coupled to computersystem 1700 via I/O interface 1730. A non-transitory computer-accessiblestorage medium may also include any volatile or non-volatile media suchas RAM (e.g. SDRAM, DDR SDRAM, RDRAM, SRAM, etc.), ROM, etc., that maybe included in some embodiments of computer system 1700 as system memory1720 or another type of memory. Further, a computer-accessible mediummay include transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as a network and/or a wireless link, such as may be implemented vianetwork interface 1740.

Various embodiments may further include receiving, sending or storinginstructions and/or data implemented in accordance with the foregoingdescription upon a computer-accessible medium. Generally speaking, acomputer-accessible medium may include storage media or memory mediasuch as magnetic or optical media, e.g., disk or DVD/CD-ROM, volatile ornon-volatile media such as RAM (e.g. SDRAM, DDR, RDRAM, SRAM, etc.),ROM, etc., as well as transmission media or signals such as electrical,electromagnetic, or digital signals, conveyed via a communication mediumsuch as network and/or a wireless link.

As used herein, “computer system” includes any of various computersystems or components thereof. One example of a computer system is arack-mounted server. As used herein, the term computer is not limited tojust those integrated circuits referred to in the art as a computer, butbroadly refers to a processor, a server, a microcontroller, amicrocomputer, a programmable logic controller (PLC), an applicationspecific integrated circuit, and other programmable circuits, and theseterms are used interchangeably herein. In the various embodiments,memory may include, but is not limited to, a computer-readable medium,such as a random access memory (RAM). Alternatively, a compact disc-readonly memory (CD-ROM), a magneto-optical disk (MOD), and/or a digitalversatile disc (DVD) may also be used. Also, additional input channelsmay include computer peripherals associated with an operator interfacesuch as a mouse and a keyboard. Alternatively, other computerperipherals may also be used that may include, for example, a scanner.Furthermore, in the some embodiments, additional output channels mayinclude an operator interface monitor and/or a printer.

As used herein, a “module” is a component or a combination ofcomponents. A module may include functional elements and systems, suchas computer systems, circuit boards, racks, blowers, ducts, and powerdistribution units, as well as structural elements, such a base, frame,housing, or container.

The various methods as illustrated in the Figures and described hereinrepresent example embodiments of methods. The methods may be implementedin software, hardware, or a combination thereof. The order of method maybe changed, and various elements may be added, reordered, combined,omitted, modified, etc.

Although the embodiments above have been described in considerabledetail, numerous variations and modifications will become apparent tothose skilled in the art once the above disclosure is fully appreciated.It is intended that the following claims be interpreted to embrace allsuch variations and modifications.

In some embodiments, an EC device includes a substrate which comprises athin glass laminate, including a paper glass foil and a layer ofadhesive. The thin glass laminate can include a glass foil that isapproximates 25 micrometers in thickness. In some embodiments, the thinglass laminate can include one or more various thickness. For example,the thin glass laminate can be approximately 50 micrometers inthickness.

In some embodiments, photochromic or thermochromic materials may be usedin place or in addition to the electrochromic (EC) materials disclosedherein. For example, some regions of a device may compriseelectrochromic materials, including an EC film stack, while otherregions may comprise at least one of an electrochromic, photochromic, orthermochromic material. Suitable photochromic materials include, but arenot limited to, triaryl-methanes, stilbenes, azastilbenes, nitrones,fulgides, spriropyrans, naphthopyrans, sprio-oxazines, and quinones.Suitable thermochromic materials include, but are not limited to, liquidcrystals and leuco dyes. Both photochromic and thermochromic materialscan be formed on the substrate in a well-known manner. No bus bars,electrodes, etc. would be needed for photochromic or thermochromicdynamic regions because light and heat respectively modulate theproperties of the materials. One exemplary embodiment using photochromicand/or thermochromic dynamic regions could be a window having at leastone electrochromic dynamic region towards the top of the window that isactively controlled for daylighting, to selectively switch between oneor more particular transmission patterns, etc., and at least onephotochromic dynamic region towards the bottom of the window thatself-darkens when under direct light, and at least a secondelectrochromic region posited in another region of the device.

In some embodiments, one or more EC devices can be used as an aperturefilter, iris, etc. for a camera device, and may be structured toselectively apodize, as discussed further above. In some embodiments,one or more EC devices can be included in architectural ‘motherboards’which can be shipped across extended distance before further processing.In some embodiments, one or more EC devices can be included in one ormore single pane windows for transportation applications and other useswhere weight is important. In some embodiments, one or more EC devices,including one or more EC devices which include a single substrate, canbe used to hide or reveal information on displays for hand held devices,computers, etc. In some embodiments, one or more EC devices can be usedin dynamic eyewear.

Further, it should be understood that one embodiment of the subjectmatter disclosed herein can comprise a window, including anarchitectural window, having a single pane, or lite, that comprises aplurality of independently controlled dynamic regions. Anotherembodiment of the subject matter disclosed herein comprises an insulatedglazing unit (“IGU”) comprising multiple regions of electrochromicwindow on one pane and clear glass on the other pane. Yet anotherembodiment of the subject matter disclosed herein comprises an IGUcomprising multiple regions of electrochromic window on one pane and alow-E, tinted, or reflective glass on the other pane. Still anotherembodiment of the subject matter disclosed herein comprises an IGUcomprising multiple regions of electrochromic window on one pane of theIGU and a patterned or special glass on the other pane in which thepatterning or features may match, compliment, and/or contrast the areasof dynamic regions on the first pane. It should be understood that theforegoing embodiments can be configured, structured, etc. so that thelite comprising the plurality of dynamic region is a clear lite, a low-Elite, a reflective, and/or partially reflective lite.

In some embodiments, one or more EC devices, including one or more ofthe EC devices, end-user devices, control systems, etc. illustrated anddisclosed with reference to one or more of FIGS. 1-17, can be includedin various applications, including EC displays, transportation windows,architectural glass applications, etc.

1.-6. (canceled)
 7. A method, comprising: structuring at least asubstrate to resist environmental element permeation between an externalenvironment and the substrate, the structuring comprising: applying aplurality of barrier layers to the substrate, such that at least onebarrier layer is applied to a presently-exposed surface which comprisesan exposed layer surface of a previously-applied barrier layer; andinterposing consecutive barrier layer applications with a cleaning ofthe presently-exposed surface, such that each consecutively-appliedbarrier layer is applied to a cleaned presently-exposed surface.
 8. Themethod of claim 7, wherein: interposing consecutive barrier layerapplications with a cleaning of the presently-exposed surface comprisesimplementing, on the presently-exposed surface, a cleaning process whichis structured to remove at least one particle present on at least thepresently-exposed surface and expose at least one gap space formed bythe at least one particle, such that a subsequently-applied barrierlayer at least partially fills the at least one exposed gap space. 9.The method of claim 7, wherein applying the plurality of barrier layersto the substrate comprises: applying a particular quantity of barrierlayers to the substrate, such that the plurality of barrier layerscomprises the particular quantity of barrier layers; wherein theparticular quantity is a minimum quantity of barrier layers associatedwith a threshold probability that the plurality of barrier layers isindependent of at least a certain quantity of continuous permeationpathways, through one or more gap spaces, through the plurality ofbarrier layers.
 10. The method of claim 7, comprising: determining,between consecutive barrier layer applications and based on generatedsensor data, that a probability that the plurality of barrier layers isindependent of at least a certain quantity of continuous permeationpathways, through one or more gap spaces, through the plurality ofbarrier layers, is less than a threshold value, such that at least onebarrier layer is subsequently applied based at least in part upon thedetermining.
 11. The method of claim 7, wherein: at least one barrierlayer, of the plurality of barrier layers, comprises a thin filmbarrier, wherein applying the thin film barrier comprises coating apresently-exposed surface with material comprising the thin filmbarrier.
 12. The method of claim 7, wherein: the environmental elementpermeation comprises permeation of at least one of water or oxygen. 13.The method of claim 7, wherein: structuring at least a substrate toresist environmental element permeation between an external environmentand the substrate comprises structuring a device provided on thesubstrate to resist environmental element permeation between theexternal environment and the device; and implementing the plurality oflayering processes over an outer surface of the substrate comprisesimplementing a plurality of layering processes over an outersubstrate-distal surface of the device.
 14. The method of claim 13,wherein: the device comprises at least one of: an electrochromic (EC)device comprising at least two separate conductive layers, on oppositesides of an electrochromic (EC) stack; a camera aperture filterstructured to selectively switch between at least two separatetransmission states, based at least in part upon selectively varyingvoltage applied to the separate conductive layer segments; a thin filmbattery device; an organic light-emitting diode (OLED) device; or aphotovoltaic film device.
 15. The method of claim 7, wherein: cleaningthe presently-exposed surface comprises at least one of: applying abrush device to the presently-exposed surface; applying a scrubbingdevice to the presently-exposed surface; applying a sonic wave to thepresently-exposed surface; applying a fluid stream to thepresently-exposed surface; directing a stream of carbon dioxide flakesto the presently-exposed surface; or directing a bubble jet stream,comprising a mixture of liquid and gaseous substances, to thepresently-exposed surface.
 16. A method, comprising: cleaning apresently-exposed apparatus surface, which comprises an exposed surfaceof an apparatus, via implementation of a particular cleaning processwhich is structured to at least partially remove particles from thepresently-exposed apparatus surface; subsequent to cleaning thepresently-exposed apparatus surface, applying a first barrier layer tothe presently-exposed apparatus surface, wherein the first barrier layeris structured to resist environmental element permeation, such that thepresently-exposed apparatus surface, subsequent to applying the firstbarrier layer, comprises an exposed surface of the applied first barrierlayer; and subsequent to applying the first barrier layer, applying atleast one additional barrier layer to the presently-exposed apparatussurface, such that the apparatus comprises a multi-layer encapsulationstack of barrier layers structured to restrict environmental elementpermeation between an external environment and the apparatus, whereinapplying each of the at least one additional barrier layers comprises:cleaning the presently-exposed apparatus surface via implementation ofan additional cleaning process which is structured to at least partiallyremove particles from the presently-exposed apparatus surface; andsubsequent to cleaning the presently-exposed apparatus surface, applyingan additional barrier layer to the presently-exposed apparatus surface,wherein the additional barrier layer is structured to resistenvironmental element permeation, such that the presently-exposedapparatus surface, subsequent to applying the additional barrier layer,comprises an exposed surface of the applied additional barrier layer.17. The method of claim 16, wherein applying at least one additionalbarrier layer comprises: applying a particular quantity of additionalbarrier layers to the apparatus, such that the multi-layer encapsulationstack of barrier layers comprises a particular quantity of barrierlayers; wherein the particular quantity is a minimum quantity of layersassociated with a threshold probability that the plurality of barrierlayers is independent of any continuous permeation pathway, through oneor more gap spaces, through the plurality of barrier layers.
 18. Themethod of claim 16, comprising: terminating application of additionalbarrier layers, based at least in part upon a determination that aprobability that the applied plurality of barrier layers is collectivelyindependent of any continuous permeation pathway, through one or moregap spaces, through the plurality of barrier layers, is greater than athreshold value.
 19. The method of claim 16, wherein: each of theparticular cleaning processes and additional cleaning processescomprises at least one of: applying a brush device to thepresently-exposed apparatus surface; applying a scrubbing device to thepresently-exposed apparatus surface; applying a sonic wave to thepresently-exposed apparatus surface; applying a fluid stream to thepresently-exposed apparatus surface; directing a stream of carbondioxide flakes to the presently-exposed apparatus surface; or directinga bubble jet stream, comprising a mixture of liquid and gaseoussubstances, to the presently-exposed apparatus surface.
 20. The methodof claim 16, wherein: the apparatus comprises a device provided on asurface of the substrate; and cleaning and subsequently applying a firstbarrier layer to the presently-exposed apparatus surface comprisescleaning, and subsequently applying the first barrier layer to, at leasta substrate-distal surface of the device.